Package Development Engineer

Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration. Drive package architecture, material selection, process development, reliability qualification, and manufacturing readiness while collaborating with internal and external partners throughout the product development lifecycle.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

• BS/MS in Electrical, Mechanical, Materials, Chemical Engineering, or related field.
• 8+ years of semiconductor package development experience.
• Proven expertise in embedded packaging, substrate technologies, and advanced interconnects.
• Strong knowledge of package reliability, failure analysis, and manufacturing processes.
• Experience with DOE, statistical analysis, and process optimization.
• Experience working with OSATs, substrate suppliers, and material vendors.
• Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
• Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
• Proven ability to lead projects across organizations and cultures in a fast-paced environment.
• Develop embedded package architectures with embedded passives, active devices, and HDI substrates.
• Define substrate stack-ups, interconnect schemes, thermal solutions, and package design rules.
• Lead process development for embedding, lamination, laser drilling, metallization, and assembly.
• Drive package qualification and reliability assessments in accordance with JEDEC, IPC, and customer requirements.
• Partner with OSATs, substrate suppliers, and material vendors to establish scalable manufacturing solutions.
• Conduct root cause analysis and implement yield, quality, and cost improvements.
• Lead cross-functional teams through concept, development, qualification, and production release.
• Develop embedded package architectures with embedded passives, active devices, and HDI substrates.
• Define substrate stack-ups, interconnect schemes, thermal solutions, and package design rules.
• Lead process development for embedding, lamination, laser drilling, metallization, and assembly.
• Drive package qualification and reliability assessments in accordance with JEDEC, IPC, and customer requirements.
• Partner with OSATs, substrate suppliers, and material vendors to establish scalable manufacturing solutions.
• Conduct root cause analysis and implement yield, quality, and cost improvements.
• Lead cross-functional teams through concept, development, qualification, and production release.