Package Development Engineer

Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages. Responsible for package architecture, substrate design, flip-chip integration, passive component assembly, reliability qualification, and manufacturing readiness. Collaborate closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, cost-effective power packaging solutions.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

• BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.

• 10+ years of semiconductor package development experience.

• Strong expertise in:

• Multi-Phase Power Modules, DrMOS, and SPS packaging

• Advanced substrate design and manufacturing

• Flip-chip assembly and package integration

• Passive component assembly and optimization

• Thermal management and reliability engineering

• High-volume manufacturing and NPI processes

• Experience working with OSATs, substrate suppliers, and material vendors.

• Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.

• Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.

• Proven ability to lead projects across organizations and cultures in a fast-paced environment.

onsemi is excited to share the base salary range for this position is $150,000.00 to $249,780.00. The Range exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf

• Lead package development from concept through production release.
• Define package architecture, materials selection, and assembly process flow.
• Develop and optimize substrate designs including stack-up, routing, power planes, via structures, and thermal features.
• Drive flip-chip integration, bump design, underfill selection, and assembly process optimization.
• Develop passive component integration strategies for capacitors, resistors, and magnetic components.
• Perform electrical, thermal, and mechanical performance optimization.
• Lead package qualification and reliability testing per JEDEC and IPC standards.
• Conduct root cause analysis and implement corrective actions for package failures.
• Collaborate with OSATs and suppliers on DFM, process development, yield improvement, and cost reduction.
• Support NPI execution and transfer technologies into high-volume manufacturing.
• Lead package development from concept through production release.
• Define package architecture, materials selection, and assembly process flow.
• Develop and optimize substrate designs including stack-up, routing, power planes, via structures, and thermal features.
• Drive flip-chip integration, bump design, underfill selection, and assembly process optimization.
• Develop passive component integration strategies for capacitors, resistors, and magnetic components.
• Perform electrical, thermal, and mechanical performance optimization.
• Lead package qualification and reliability testing per JEDEC and IPC standards.
• Conduct root cause analysis and implement corrective actions for package failures.
• Collaborate with OSATs and suppliers on DFM, process development, yield improvement, and cost reduction.
• Support NPI execution and transfer technologies into high-volume manufacturing.