Microelectronics Engineering Technician – Wire Bonding & Precision Assembly

CTG is seeking to fill a Microelectronics Engineering Technician – Wire Bonding & Precision Assembly position for our client.

Location: San Jose, CA

Duration: On-going Contract

Duties:

• Perform microelectronics assembly, including wire bonding and precision component assembly.
• Operate wire bonding equipment and support component bonding processes using adhesives.
• Perform precision assembly of electromechanical components using microscopes and specialized equipment.
• Conduct basic mechanical and electrical testing of components and assemblies.
• Set up, maintain, and troubleshoot a variety of electronics testing and electromechanical equipment.
• Conduct equipment testing to verify specifications and calibrate systems for optimal performance.
• Work closely with engineers to build and test prototypes for new electromechanical systems.
• Assist with component selection, prototype assembly, testing, and process development.
• Maintain accurate records of equipment maintenance, repairs, testing, and calibration procedures.
• Collaborate with engineers, technicians, and manufacturing personnel to support successful system integration, process development, and operation.
• Diagnose and resolve basic issues with electromechanical systems and equipment.

Skills:

• Basic understanding of electrical and mechanical principles, including circuits, sensors, actuators, and control systems.
• Hands-on experience with wire bonding processes and equipment.
• Familiarity with adhesive-based component bonding processes.
• Experience with precision assembly equipment and techniques.
• Strong mechanical dexterity and ability to work effectively under a microscope.
• Ability to perform basic mechanical and electrical testing.
• Ability to troubleshoot electromechanical systems and analyze test data.
• Experience using hand and power tools for assembly, disassembly, and repair.
• Proficiency with Microsoft Office applications, including Word and Excel.
• Preferred experience with programming and control systems.
• Preferred ability to operate analytical and precision instruments such as AFM, SEM, Zygo, and Tencor.

Experience:

• Minimum 3 years of experience working in the high-tech industry.
• Experience with wire bonding, precision assembly, and electromechanical equipment is required.
• Experience supporting prototype builds, equipment maintenance, testing, or process development is preferred.
• Minimum 5 years of high-tech industry experience is preferred.
• Experience in the medical device industry is preferred.

Education:

• Associate degree in Math, Science, Engineering, Electronics, or a related technical field is preferred.
• Equivalent combination of education, technical training, and hands-on experience may be considered.

Excellent verbal and written English communication skills and the ability to interact professionally with a diverse group are required.

CTG does not accept unsolicited resumes from headhunters, recruitment agencies, or fee based recruitment services for this role.

To Apply:

To be considered, please apply directly to this requisition using the link provided. Kindly forward this to any other interested parties. Thank you!

The expected base salary for this position ranges from $30.00 to $40.00/hour. Salary offers are based on a wide range of factors including relevant skills, training, experience, education, market factors, and where applicable, licensure or certifications obtained. In addition to salary, a competitive benefit package is also offered.