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MGR II R&D/PRODUCT DVL ENGINEERING (SI BtB)

TE Connectivity plc

  • Middletown, OH
  • 9 days ago

    Highlights

    Advanced capability in building and leading a high performing team - experienced in assessing talent fit (current team and future hires), aligning skills to business needs, identifying skillset gaps needed to strengthen the team, identifying organizational gaps creating barriers, and taking the necessary actions to maintain a high-performing team. As a member of the Digital Data Networks (DDN) business in TE Connectivity you will play a key role in the design of products for high-speed products in the connector, cable assembly, and/or radio system industry-targeting high-speed communications and connectivity within datacenters and wireless infrastructure.

    Numbers & Facts

    LocationMiddletown, OH
    IndustryElectronics, Components, and Semiconductor Mfg
    Company Size10,000 employees or more
    Year Founded2007
    Websitehttp://www.te.com/usa-en/home.html

    Description

    Job Description

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    Job Title: MGR II R&D/PRODUCT DVL ENGINEERING (SI BtB)

    Posting Start Date: 7/21/26

    At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.

    Job Description:

    Job Overview

    As a member of the Digital Data Networks (DDN) business in TE Connectivity you will play a key role in the design of products for high-speed products in the connector, cable assembly, and/or radio system industry-targeting high-speed communications and connectivity within datacenters and wireless infrastructure. As a manager of Product Development Engineering in Signal Integrity (SI), you will lead a team of SI engineers in all aspects of electrical design, simulation, and verification-validation testing. You will be responsible for leading your team to successfully achieve business objectives in a dynamic business environment while fostering a culture of high performance, innovation, and employee wellbeing.

    Job Requirements

    • Manage and lead a team of regional/global signal integrity engineers in establishing signal integrity design performance and functional requirements for new products
    • Lead the team to perform signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
    • Guide the team in connector design and qualifications from a signal integrity standpoint with a focus on making data driven decisions about the product functionality and areas for improvement.
    • Create actionable recommendations based upon design reviews and simulation results.
    • Lead the team in communicating actions and impacts clearly to stakeholders including management, customers, and the technical community.
    • Align the technology roadmap with the market trends, customer needs, and implement accordingly.
    • Drive a culture of innovation using a base of traditional approaches and external knowledge to develop innovative solutions.
    • Effectively lead a regional/global team of SI engineers of varying levels of experience with different backgrounds, experiences, and cultures.
    • Drive high performance by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability.
    • Manage employee wellbeing by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives.

    What your background should look like

    • Bachelor's degree in Electrical Engineering or equivalent work experience; Master's Degree preferred
    • Generally requires 13 years of relevant work experience in electrical Design, RF design or PCB design
    • Generally requires a minimum of 5 years of progressive leadership and people management experience in a global environment
    • A solid understanding of electromagnetic theory and electrical circuit behavior
    • Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
    • Proficient with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)
    • Proficient with high-speed test equipment (VNA, TDR, BERT)
    • Proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.
    • Proficient with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially as associated with connector FP and card-edge interfaces
    • Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.
    • Practiced analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.
    • Experience with physical layer communications systems and architectures.
    • Fluent in English (both verbal and written)
    • Ability to work in a global environment - able to accommodate varying time zones and capable of collaborating with individuals across geographies.
    • Master problem solver - able to solve unusually high complexity situations with little to no direction. Pro-active in identifying complex issues, providing solutions, and driving improvements to evolve procedures
    • Advanced capability in presenting technical solutions to customers and upper management
    • Demonstrated experience leading/developing a team of 10+ experienced professionals who exercise latitude and independence in their assignments with accountability for team/department performance, project delivery, and resource allocation.
    • Advanced capability in building and leading a high performing team - experienced in assessing talent fit (current team and future hires), aligning skills to business needs, identifying skillset gaps needed to strengthen the team, identifying organizational gaps creating barriers, and taking the necessary actions to maintain a high-performing team.
    • Demonstrated experience and accountability for establishing and ensuring adherence to budgets, schedules, and work plans.
    • Advanced capability in leading cross-functional new product development projects which require strong collaboration and influencing skills to achieve the right outcome for the business.
    • Advanced capability in driving a data analytics mindset across the team - identifying the most meaningful data to collect, analyzing it, drawing conclusions, and presenting those conclusions as data intelligence to provide insight and drive innovative solutions for the business.
    • Advanced capability in leading change in a high-paced and dynamic environment with an understanding of common barriers to effectively managing change.
    • Advanced continuous improvement skillset with demonstrated experience implementing best practices to enhance engineering efficiency.

    Competencies

    SET : Strategy, Execution, Talent (for managers)

    Job Locations:

    Posting City: SHANGHAI

    Job Country: China

    Travel Required: 10% to 25%

    Requisition ID: 155642

    Workplace Type: Onsite

    External Careers Page: Engineering & Technology

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    About Company

    TE Connectivity is an industry leader with an entrepreneurial spirit, fueled by innovation and collaboration. Our emphasis on forward thinking has attracted the brightest industry minds, allowing them to thrive and create breakthrough solutions that deliver a competitive advantage to our customers.

    TE Connectivity is a global, $12.1 billion company that designs and manufactures over 500,000 products that connect and protect the flow of power and data inside the products that touch every aspect of our lives. Our nearly 90,000 employees partner with customers in virtually every industry—from consumer electronics, energy and healthcare, to automotive, aerospace and communication networks—enabling smarter, faster, better technologies to connect products to possibilities.

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