Junior Packaging Engineer

Junior Packaging Engineer

Job Description:

RFIC package development, supporting NPI from concept through production release. This individual will work with product and design engineers to deliver optimum, cost effective packaging solutions as well as providing thermal design and analysis for IC package and system level physical designs. Package types include plastic molded leadframe packages, ceramic packages and metal packages for RF and Microwave IC's. This individual may be required to work on multiple product development programs in parallel to deliver packaging solutions on schedule for high volume manufacturing.

Responsibilities:

• Provide technical support for RF/microwave plastic, ceramic and metal packages
• Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
• Provide thermal and mechanical modeling for new packages and for improving existing package designs
• Update design rules for packaging as required
• Participate in and contribute to assembly process development internally and at our contract manufacturers
• Participate in troubleshooting IC packaging defects, then define and implement solutions