IC Packaging Design Engineer, Amazon Leo

Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.

Come work at Amazon!

The Role

As an IC Packaging Design Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third-party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.

As a member of the packaging team, you will be responsible for package design for mm-wave beamforming SoCs and front-end modules. Strong focus will be on creating the most power optimized solution for a given system performance.

Export Control Requirement

Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Key job responsibilities

In this role you will:

• Collaborate with digital design, and RF chip designers define floorplans, bump maps, and ball maps for beamforming ICs.
• Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
• Analyze cost/performance trade-offs, and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN, etc.
• Setup and run 3D electromagnetic simulations of package + PCB in tools such as HFSS and Momentum to verify your designs.
• Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
• Assist the thermal team in defining and running thermal simulations of packages and PCBs.
• Collaborate with the Antenna and EE teams to design and layout test and application PCBs for your packages.
• Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
• Define and implement AI-driven workflows for packaging design, leveraging automation and machine learning to accelerate design iterations and optimize performance.