Hybrid Microelectronics Assembly Operator

We are seeking a Hybrid Operator to join our microelectronics manufacturing team, working under the guidance of our Senior Hybrid Operator. This role is well-suited to someone with solid foundational experience who is ready to grow into more complex, high-reliability builds (e.g., aerospace, defense, or medical device applications

Key Responsibilities

• Perform die attach operations (epoxy and/or eutectic methods) on ceramic substrates and hybrid circuits, with support from senior staff on complex builds

• Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent standards

• Perform fly wire (jumper wire) installation and tack wire bonding/staking for circuit interconnects

• Solder fine-pitch components, leads, and interconnects under microscope

• Assist with or perform lid seal operations (seam seal, parallel seam welding, and/or solder seal) under supervision

• Conduct in-process visual inspections per IPC/MIL specifications

• Read and interpret schematics, assembly drawings, and work instructions

• Maintain accurate documentation/travelers for traceability

• Escalate process issues to Senior Operator and support troubleshooting efforts

• Maintain a clean, ESD-safe workstation and comply with all safety protocols

Required Qualifications

• 2–5 years of hands-on experience in hybrid microelectronics assembly

• Working proficiency in die attach, wire bonding, and fly wire/tack wire methods

• Exposure to soldering and lid seal processes (independent proficiency not required but preferred)

• Familiarity with MIL-STD-883, J-STD-001, or IPC-A-610 standards (or equivalent)

• Ability to work under high magnification (microscope) for extended periods

• Strong attention to detail and manual dexterity

• Willingness to learn from and take direction from senior technical staff

Preferred Qualifications

• IPC certification(s), or working toward certification

• Experience or coursework related to government/defense contract manufacturing

• Prior experience in a cleanroom or controlled environment

Physical Requirements

• Ability to sit for extended periods while working under a microscope

• Fine motor control for precision assembly work

You should be proficient in:

• Die Attach/Bonding
• Microscope Proficiency
• Wirebonding