Failure Analysis Engineer

Applied Optoelectronics Inc

  • Huntsville, AL
  • 30+ days ago

    Highlights

    Hands-on experiences on sample Preparation & Imaging: Utilize Focused Ion Beam (FIB) to prepare TEM samples and perform high-resolution imaging (HR-STEM) to identify defects at the atomic level. D in Material Science Engineering, Electrical Engineering, Physics, or related discipline plus 1 year of working experience in semiconductor laboratory or fabrication is preferred.

    Numbers & Facts

    LocationHuntsville, AL

    Description

    Summary

    A failure analysis engineer for the process integration team will be responsible for failure analysis of semiconductor optical laser devices. He/She should have experience with front-end and back-end-of-line, and packaging processing. Good understanding of reliability evaluation techniques and understanding failure analysis experience is desirable. He/she will collaborate with other individuals and functional teams, define projects, address issues, develop improvement plans, and finally to document and deliver the desired end results.

    Job Duties

    • Responsible for internal failure analysis including device decap, internal microscopic and SEM inspection, internal measurement data analysis.

    • Hands-on experiences on sample Preparation & Imaging: Utilize Focused Ion Beam (FIB) to prepare TEM samples and perform high-resolution imaging (HR-STEM) to identify defects at the atomic level.

    • Root Cause Analysis: Analyze structural, electrical, and physical defects in semiconductor devices, identifying issues related to yield, reliability, or process.

    • Material Characterization: Apply Energy Dispersive X-ray Spectroscopy (EDX/EDS) and other analytical techniques (SIMS, XPS, SEM) to characterize materials.

    • Reporting & Collaboration: Document findings in detailed technical reports, present data to cross-functional teams (design, process, QA), and support continuous improvement initiatives.

    • Equipment Maintenance: Ensure high uptime of TEM/FIB equipment through routine calibration and troubleshooting.

    Qualifications

    • Hands-on experience with Transmission Electron Microscopy (TEM) and FIB in a lab or manufacturing environment (typically 13+ years).

    • Masters degree or Ph.D in Material Science Engineering, Electrical Engineering, Physics, or related discipline plus 1 year of working experience in semiconductor laboratory or fabrication is preferred.

    • Knowledge of compound semiconductor device theory is desired.

    • Microsoft Access, SQL, LabVIEW and other programing skills preferred.

    • Experience with DOE techniques and SPC (Statistical Process Control) is preferred.

    • Strong data analysis and problem solving skills.

    • Detail oriented and self-motivated.

    • Ability to work independently and as a team.

    • Ability to work in clean room environment wearing smock

    • Excellent interpersonal and communication skills for successful inter and intra-group interactions.

    Physical Demands and Work Environment

    • Subject to noise, vibration, dust, odors, and exposure to toxic or caustic chemicals.

    • The associate work in a manufacturing environment and be require to wear personal protective equipment.

    Location

    This position will be on-site based in Sugar Land, Texas.

    WHY AOI?

    In addition to competitive salary, AOI offers

    • Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual and family needs

    • Employer matching on 401(k) deferrals

    • Generous PTO policy, with unused PTO payout at end of the year

    • Relocation package available within US

    • Immigration sponsorships (Must be currently authorized to work in the US)

    We do not accept unsolicited proposals from third-party recruiters or agencies. Contacting hiring managers directly may result in disqualification of submissions.

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