Position Summary
The Failure Analysis Engineer (FAE) is responsible for investigating, analyzing, and identifying root causes of

failures in electronic assemblies, systems, and components used in high-performance computing, server, and AI-
related hardware products. This role supports continuous improvement and product reliability initiatives

through data-driven analysis, cross-functional collaboration, and corrective action implementation. The FAE will
leverage advanced diagnostic tools and methods to enhance product quality, manufacturing yields, and
customer satisfaction

Supervisory Responsibilities
• May oversee FA Technicians and provide technical guidance and training.
• Coordinates project assignments and ensures timely completion of analysis reports.
Key Responsibilities
Failure Analysis and Root Cause Investigation (50%)
• Perform electrical, mechanical, and thermal failure analysis on defective units from production, field
returns (RMA), and reliability testing.
• Utilize analytical tools such as oscilloscopes, X-ray, SEM/EDS, decapsulation, and cross-sectioning for
detailed investigation.
• Identify failure modes, document analysis results, and establish root cause and contributing factors.
• Correlate failures with design, process, and material data to support engineering improvements.
Data Collection and Reporting (20%)
• Maintain detailed FA reports, including findings, corrective actions, and risk assessments.
• Present analysis summaries to internal engineering, manufacturing, and customer teams.
• Compile trend data on recurring failure modes and propose mitigation actions.
• Track metrics on failure rates, mean time between failure (MTBF), and reliability indicators.

JOB DESCRIPTION
Cross-Functional Collaboration (15%)
• Partner with manufacturing, R&D, and quality engineering teams to drive corrective and preventive
actions (CAPA).
• Support supplier quality teams in component failure validation and incoming inspection processes.
• Coordinate with customer support and warranty analysis teams on field failure investigations.
Process and Product Improvement (10%)
• Participate in Design for Manufacturability (DFM) and Design for Reliability (DfR) reviews.
• Recommend design or process modifications to reduce defect rates and improve overall product
robustness.
• Contribute to process control documentation and standard operating procedures (SOPs).
Compliance and Safety (5%)
• Ensure all FA activities comply with ESD, ISO, and environmental standards (e.g., RoHS, REACH).
• Maintain lab equipment calibration and safe operating practices.

Education:
• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
required.
• Master’s degree or equivalent experience in Reliability Engineering, Failure Analysis, or Quality
Engineering preferred.

Experience:
• 3–5 years of experience in failure analysis or reliability engineering within electronics, semiconductor,
or high-tech manufacturing industries.
• Experience with AI server systems, GPU boards, or data center hardware is a plus.
Technical Skills:
• Proficiency with diagnostic equipment (oscilloscope, DMM, logic analyzer, X-ray, SEM, FIB, etc.)
• Knowledge of SMT manufacturing, solder joint analysis, and IPC standards.
• Familiarity with reliability testing (HALT, HASS, thermal cycling, vibration testing).
• Experience with data analysis tools (Python, JMP, Minitab, Excel).
• Ability to interpret schematics, layout drawings, and bill of materials (BOM).
Core Competencies
• Analytical Thinking: Strong ability to dissect complex problems and identify root causes.
• Technical Expertise: Deep understanding of electrical/electronic systems, PCB design, and
semiconductor behavior.
• Collaboration: Works effectively with multidisciplinary teams to solve technical challenges.
• Communication: Ability to write clear, data-supported reports and present findings to technical and
non-technical audiences.
• Continuous Improvement: Passion for enhancing product reliability and manufacturing efficiency
Performance Indicators (KPI’s)
• Failure Analysis Turnaround Time (TAT)
• Root Cause Accuracy and Verification Rate
• Corrective Action Implementation Effectiveness
• Reduction in Recurrence Rate of Failures
• Customer Satisfaction (internal/external) with FA deliverables
Working Conditions
• On-site role at Wistron’s Alliance, TX manufacturing facility.
• Exposure to electronics lab environments (ESD-safe areas, microscopes, soldering stations).
• Occasional travel to suppliers, customer sites, or corporate headquarters (domestic/international).
• Normal working hours with flexibility to support urgent FA cases and project deadlines.