Engineering Technician, Photolithography (Night Shift)

Key Responsibilities: Semiconductor visual die inspection to ensure MIL-STD 883 and customer specification compliance.

Job Responsibilities:

• Heavy use of microscope and other die inspection tools
• Handles semiconductor wafers and die
• Visually inspects to customer criteria and MIL-STD - die level (commercial, Class S, Class K as required)
• Familiarity with AOI, die sorting equipment (manual, semi and full auto)
• Capable of binning defects
• Capable of interpreting wafer map
• Familiarity with FOD, contamination and ESD management
• Disposition the material based on the specification and criteria approved
• Generate defect images and pareto charts (Excel use) to provide feedback to upstream processing (closed loop feedback)
• Attend meetings to provide yield data and contribute to defect root cause analysis and potential corrective actions

Skills:

• Must be able to sit for a long period of time.
• Must be able to work under a microscope for an extended period of time - optical and digital
• Must pay attention to details, being meticulous.
• Must be well-organized and detail oriented
• Must know MIL-STD 883 details and learn customer specific requirements