Highlights
Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university; Master's degree or PhD preferred or Minimum 15 years of professional experience in Electromechanical Engineering or related discipline without a degree. • Collaborate with mechanical and electrical engineering analysts to develop advanced Finite Element Analysis (FEA) to perform Multiphysics models and simulations for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress including operation shock and vibration.
Numbers & Facts
| Location | Orlando, FL |
| Industry | Staffing/Employment Agencies |
| Company Size | 10,000 employees or more |
| Year Founded | 1956 |
| Website | https://nescoresource.com/ |
Description
Description:
Candidates must have BS degree and engineering experience described below.
Standard Job Description
You will be the Electro Mechanical Engineer for the Hardware Engineering team at *** Missiles and Fire Control (MFC). Our team delivers precision engagement aerospace and defense systems, designing, building and fielding the electrical hardware that powers missiles, sensors and other mission critical subsystems for the United States and allied militaries.
What You Will Be Doing
As the Electro Mechanical Engineer, you will have ownership of package hardware design, heat transfer and thermal dissipation, structural integrity and mechanical survivability of completed 3DHI packages throughout their operational lifespans. Your responsibilities will include
• Design multichip package devices, including package substrates, Integrated Heat Spreaders and attach mechanism, stiffeners, and complex thermal management system integration to manage high thermal dissipation requirements.
• Collaborate with mechanical and electrical engineering analysts to develop advanced Finite Element Analysis (FEA) to perform Multiphysics models and simulations for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress including operation shock and vibration.
• Define and execute packaging qualification plans adhering to project requirements, JEDEC and MIL-SPEC standardizations (e.g., Highly Accelerated Stress Testing / HAST).
• Investigate and perform failure analysis loops on critical component interface and intermetallic connections including anomalies like cracked solder joints, delaminated layers, and warped package substrates. Implement corrective actions to mitigate identified failure modes in manufacturing and incorporate findings into product revisions while capturing lessons learned for future development activity.
• Architecting, designing, and validating advanced circuit card packages
• Designing high-density circuit cards, cable assemblies, and interconnect solutions that meet size, weight, power, security, and performance constraints
• Designing and developing electromechanical systems for advanced programs, special programs, and IRAD programs, including printed wiring boards, circuit/electronic card assemblies, harness assemblies, and sub-assemblies
• Leading and documenting design assurance reviews, tracking issues, and driving corrective actions to closure
• Performing thermal, signal integrity, and electromagnetic compatibility analyses to ensure robust operation in harsh DoD environments
• Coordinating with cross-functional teams — systems, hardware, software, test, and supply chain — to deliver high-quality results on schedule and within budget
• Managing risk, schedule, and earned value metrics, and reporting status to senior leadership
Required Experience:
• Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university; Master's degree or PhD preferred or Minimum 15 years of professional experience in Electromechanical Engineering or related discipline without a degree
Candidates must have at least 11 years experience with the following:
• 3D Heterogeneous Integration (3DHI)
• Advanced Packaging
• Technical or project leadership experience supporting the production of high-reliability electronics products
• Microelectronics design
• Proficient in CREO modeling and electromechanical system design
• Project leadership/management experience throughout the engineering/production lifecycle: scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM)
• Experience in presentation, oral and written communication to facilitate effective and efficient interchanges between co-workers, leaders, and customers
• Experience working with cross-functional teams across multiple locations
• Experience capturing flowed and derived requirements for electromechanical designs
Nesco Resource offers a comprehensive benefits package for our associates, which includes a MEC (Minimum Essential Coverage) plan that encompasses Medical, Vision, Dental, 401K, and EAP (Employee Assistance Program) services.
Nesco Resource provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state, or local laws.
Candidates must have BS degree and engineering experience described below.
Standard Job Description
You will be the Electro Mechanical Engineer for the Hardware Engineering team at *** Missiles and Fire Control (MFC). Our team delivers precision engagement aerospace and defense systems, designing, building and fielding the electrical hardware that powers missiles, sensors and other mission critical subsystems for the United States and allied militaries.
What You Will Be Doing
As the Electro Mechanical Engineer, you will have ownership of package hardware design, heat transfer and thermal dissipation, structural integrity and mechanical survivability of completed 3DHI packages throughout their operational lifespans. Your responsibilities will include
• Design multichip package devices, including package substrates, Integrated Heat Spreaders and attach mechanism, stiffeners, and complex thermal management system integration to manage high thermal dissipation requirements.
• Collaborate with mechanical and electrical engineering analysts to develop advanced Finite Element Analysis (FEA) to perform Multiphysics models and simulations for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress including operation shock and vibration.
• Define and execute packaging qualification plans adhering to project requirements, JEDEC and MIL-SPEC standardizations (e.g., Highly Accelerated Stress Testing / HAST).
• Investigate and perform failure analysis loops on critical component interface and intermetallic connections including anomalies like cracked solder joints, delaminated layers, and warped package substrates. Implement corrective actions to mitigate identified failure modes in manufacturing and incorporate findings into product revisions while capturing lessons learned for future development activity.
• Architecting, designing, and validating advanced circuit card packages
• Designing high-density circuit cards, cable assemblies, and interconnect solutions that meet size, weight, power, security, and performance constraints
• Designing and developing electromechanical systems for advanced programs, special programs, and IRAD programs, including printed wiring boards, circuit/electronic card assemblies, harness assemblies, and sub-assemblies
• Leading and documenting design assurance reviews, tracking issues, and driving corrective actions to closure
• Performing thermal, signal integrity, and electromagnetic compatibility analyses to ensure robust operation in harsh DoD environments
• Coordinating with cross-functional teams — systems, hardware, software, test, and supply chain — to deliver high-quality results on schedule and within budget
• Managing risk, schedule, and earned value metrics, and reporting status to senior leadership
Required Experience:
• Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university; Master's degree or PhD preferred or Minimum 15 years of professional experience in Electromechanical Engineering or related discipline without a degree
Candidates must have at least 11 years experience with the following:
• 3D Heterogeneous Integration (3DHI)
• Advanced Packaging
• Technical or project leadership experience supporting the production of high-reliability electronics products
• Microelectronics design
• Proficient in CREO modeling and electromechanical system design
• Project leadership/management experience throughout the engineering/production lifecycle: scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM)
• Experience in presentation, oral and written communication to facilitate effective and efficient interchanges between co-workers, leaders, and customers
• Experience working with cross-functional teams across multiple locations
• Experience capturing flowed and derived requirements for electromechanical designs
Nesco Resource offers a comprehensive benefits package for our associates, which includes a MEC (Minimum Essential Coverage) plan that encompasses Medical, Vision, Dental, 401K, and EAP (Employee Assistance Program) services.
Nesco Resource provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state, or local laws.
Benefits
Paid Sick Days, Parking, Performance Bonus, Employee Referral Program
About Company
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