Highlights
Bachelor of Science in Electrical Engineering, Mechanical Engineering or a closely related STEM field, master's or PhD preferred; or 15+ years of electromechanical engineering experience without a degree. Work with mechanical and electrical analysts on finite element analysis and multiphysics models for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress including shock and vibration.
Numbers & Facts
| Location | Orlando, FL |
| Job Type | Contractor |
| Industry | Other/Not Classified |
| Salary | $75.42–$93.94 Per Hour |
| Year Founded | 2009 |
| Headquarters | Boston, MA, US |
| Website | http://www.uspro.net |
Description
Electro-Mechanical Engineer - Advanced Packaging & Thermal (3DHI)
12728
Location: Orlando, FL (Onsite)
Pay: $93.94 per hour, overtime eligible
Employment type: Contract (W-2), approximately 6 months
Schedule: 4/10 A, 1st shift; onsite full time
Security clearance: No clearance to start, but candidates must be able to obtain one
About the role
Own the package design behind high reliability microelectronics. You will design multichip packages and the thermal management that keeps them alive, drive the analysis and qualification behind them, and run the failure investigations when interfaces fail.
What you will do
Design multichip package devices including package substrates, integrated heat spreaders and attach mechanisms, stiffeners, and complex thermal management system integration for high thermal dissipation
Own heat transfer and thermal dissipation, structural integrity and mechanical survivability of completed packages across their operational life
Work with mechanical and electrical analysts on finite element analysis and multiphysics models for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress including shock and vibration
Define and execute packaging qualification plans to project requirements and JEDEC and MIL-SPEC standards, including highly accelerated stress testing
Investigate and perform failure analysis on critical component interfaces and intermetallic connections, including cracked solder joints, delaminated layers and warped substrates
Implement corrective actions, feed findings into product revisions and capture lessons learned
What you bring
Bachelor of Science in Electrical Engineering, Mechanical Engineering or a closely related STEM field, master's or PhD preferred; or 15+ years of electromechanical engineering experience without a degree
11+ years across: 3D heterogeneous integration, advanced packaging, microelectronics design
Technical or project leadership supporting production of high reliability electronics
Proficient in Creo modelling and electromechanical system design
Project leadership across the engineering and production lifecycle: scoping, sizing, cost estimation, planning, scheduling, staffing, tracking and earned value management
Strong written and oral communication with co-workers, leaders and customers
Able to obtain a security clearance
Nice to have
JEDEC and MIL-SPEC qualification experience
Highly accelerated stress testing
Finite element analysis and multiphysics simulation
Failure analysis on solder joints and package interfaces
About Company
USPRO is a nationwide staffing and recruiting firm specializing in aerospace, defense, engineering, manufacturing, and industrial talent. Since 2009, we’ve connected skilled professionals with leading organizations and built our reputation on integrity, responsive service, and finding the right fit for both the candidate and the employer.