| Location | San Francisco, California |
| Website | https://www.midjourney.com |
Be the generalist EE for the scanner system: integration, bring-up, debugging, and making the electrical side of the device reliable and serviceable.
Own ultrasound experimentations that feeds the image reconstruction team
Design and execute experiment setups for transducer characterization (element sensitivity, bandwidth, cross-talk mapping, beam profile measurements) and ex vivo / phantom clinical testing.
Acquire, process, and analyze RF and baseband signals for data quality assessment and benchmarking.
Design simple boards and adapters as needed (monitoring, power/safety, interface/conditioning), and take them from prototype through a stable revision.
Prototype quickly, then harden what works: wiring/harnessing, grounding, safety interlocks, and reliable integration across subsystems.
Own practical test setups and documentation (fixtures, scripts, procedures) that make experiments repeatable and results comparable over time.
Strong hands-on EE background with experience building, debugging, and iterating on real systems in the lab.
Solid understanding of signal processing fundamentals — knows what to measure, how to condition and digitize it, and how to evaluate signal quality in the context of an imaging system (SNR, bandwidth, dynamic range, artifacts).
Comfortable spanning system integration + occasional design work (schematics/layout reviews or light PCB design) in a fast-moving environment.
Ability to work at the boundary between hardware and algorithms: measure reality, communicate constraints, and help close gaps vs simulation.
High agency and practicality: able to set up experiments, get trustworthy data, and unblock others on a lean team.
Analog/mixed-signal, or high-speed data capture experience; strong instincts for instrumentation and noise/debugging.
Ultrasound or acoustic sensor handling: hydrophone calibration and field mapping, transducer impedance characterization, element-level sensitivity and bandwidth testing, acoustic coupling optimization (water path, gel, membrane interfaces).
Signal processing skills: spectral analysis (FFT, short-time spectra), time-frequency methods, matched filtering, envelope detection / Hilbert transforms, time-of-flight extraction, and coherent vs. incoherent averaging for SNR improvement.
Understanding of imaging principles or direct experience with imaging systems: beamforming concepts (delay-and-sum, synthetic aperture), point spread function characterization, resolution/contrast metrics, image artifact identification (grating lobes, side lobes, ring artifacts, motion blur).
Wave physics background (acoustic, EM, or optical): propagation, reflection/transmission at interfaces, attenuation and dispersion in tissue-mimicking media, near-field vs. far-field behavior, diffraction.
Light PCB design for simple boards (Altium/KiCad/etc.) and comfort bringing boards up on the bench.
Comfort aligning “device reality” with “model reality” (calibration, timing, parameter tracking, reproducibility).
Safety-conscious integration experience (EMI/EMC, grounding, interlocks) in complex electromechanical systems.