Dry/Plasma Etch Gan Process Development Engineer (Sm1)

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We are seeking a highly motivated Advanced GaN Process Development Engineer to join our Plasma Etch Process Development team. This role is responsible for developing, optimizing, and transferring advanced plasma etch processes supporting next-generation GaN semiconductor technologies. The engineer will work closely with integration, equipment, metrology, and manufacturing teams to drive technology innovation, improve process capability, and enable successful product ramp into high-volume manufacturing.

The ideal candidate possesses strong technical expertise in plasma etch fundamentals, semiconductor process development, statistical data analysis, and cross-functional problem solving.

The responsibilities of a Manufacturing Development Process Engineer in this role include:

• Process Development

• Develop and optimize plasma etch processes for advanced semiconductor devices.

• Design and execute experiments (DOE) to improve critical process metrics, including:

• Etch rate

• Selectivity

• Critical dimension (CD) control

• Profile control

• Defectivity

• Uniformity

• Characterize process performance and establish process windows for manufacturing robustness.

• Evaluate new process chemistries, hardware configurations, and chamber technologies.

Technology Introduction

• Support development and qualification of next-generation etch technologies.
• Collaborate with device integration teams to meet product and technology requirements.
• Drive process readiness for technology transfers from development into manufacturing.
• Establish process specifications, control plans, and release documentation.

Tool and Equipment Engineering

• Partner with equipment engineering teams to improve tool capability, productivity, and reliability.
• Lead chamber matching, equipment qualification, and process performance improvement activities.
• Support installation and startup of new etch platforms.

Data Analysis & Continuous Improvement

• Analyze complex process datasets using statistical methods and data analytics tools.
• Identify root causes of process excursions and implement corrective actions.
• Lead yield improvement and defect reduction initiatives.
• Utilize SPC methodologies to monitor and improve process stability.

Cross-Functional Collaboration

• Work closely with:

• Process Integration

• Manufacturing

• Yield Engineering

• Metrology

• Equipment Engineering

• Quality and Reliability teams

• Present technical findings and recommendations to management and key stakeholders.

• Mentor junior engineers and technicians as needed.

Minimum requirements:

• 5+ years of semiconductor plasma/dry etch process development experience.

• Bachelors in an engineering, science, or related STEM discipline

• Strong foundation in statistical process control, engineering change control and process release strategies

• Experience with DOE methodologies and statistical analysis.

• Familiarity with metrology techniques including SEM, CD-SEM, ellipsometry and defect inspection tools.

Preferred qualifications:

• Experience in Gallium Nitride (GaN) and/or similar wide-bandgap III-V nitrides processes and technology development
• Strong foundation in statistical process control, engineering change control and process release strategies
• Proficiency with Python, Claude, or other AI models or tools is a plus
• Demonstrated strong analytical and problem solving skills resulting in innovative and creative process solutions
• Experience with process development and transfer on etch platforms (LAM, AMAT, TEL, etc)
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different job functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for result

Minimum requirements:

• 5+ years of semiconductor plasma/dry etch process development experience.

• Bachelors in an engineering, science, or related STEM discipline

• Strong foundation in statistical process control, engineering change control and process release strategies

• Experience with DOE methodologies and statistical analysis.

• Familiarity with metrology techniques including SEM, CD-SEM, ellipsometry and defect inspection tools.

Preferred qualifications:

• Experience in Gallium Nitride (GaN) and/or similar wide-bandgap III-V nitrides processes and technology development
• Strong foundation in statistical process control, engineering change control and process release strategies
• Proficiency with Python, Claude, or other AI models or tools is a plus
• Demonstrated strong analytical and problem solving skills resulting in innovative and creative process solutions
• Experience with process development and transfer on etch platforms (LAM, AMAT, TEL, etc)
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different job functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for result