Device Engineer

Avicenatech Corp

  • Sunnyvale, CA
  • 7 days ago

    Highlights

    Device design & modeling: Develop and optimize GaN-based microLED device structures, including epitaxial layer stacks, active regions, and contact schemes, using TCAD and analytical models to hit efficiency, bandwidth, current-density and reliability targets. You will translate device physics into manufacturable, high-yield emitters that meet aggressive targets for efficiency, speed, and array uniformity, working across the full stack from epitaxy and process integration to on-wafer test.

    Numbers & Facts

    LocationSunnyvale, CA

    Description

    Job Title

    Device Engineer

    Role Summary

    As a Device Engineer at Avicena, you will drive the design, fabrication, electro-optical characterization and qualification of GaN microLED devices at the heart of our LightBundle interconnect platform. You will translate device physics into manufacturable, high-yield emitters that meet aggressive targets for efficiency, speed, and array uniformity, working across the full stack from epitaxy and process integration to on-wafer test.

    Key Responsibilities

    • Electro-optical characterization: Design and execute L-I-V, spectral, modulation-bandwidth, and reliability-relevant measurements on single devices and large arrays; correlate results to design and process parameters.
    • Device design & modeling: Develop and optimize GaN-based microLED device structures, including epitaxial layer stacks, active regions, and contact schemes, using TCAD and analytical models to hit efficiency, bandwidth, current-density and reliability targets.
    • Performance improvement: Diagnose loss mechanisms (non-radiative recombination, sidewall effects, current crowding) and drive design/process changes to improve wall-plug efficiency and high-speed performance.
    • Cross-functional collaboration: Partner with epitaxy, process, packaging, test, and systems teams to align device performance with link-level and product requirements.
    • Fabrication & integration: Define and refine process flows in collaboration with process integration and foundry partners; own device-level design-of-experiments from wafer to characterization.
    • Documentation: Establish device specifications, test plans, and technical reports; contribute to IP generation and internal design reviews.

    Required Qualifications

    • Education: MS or PhD in Electrical Engineering, Applied Physics, Materials Science, Photonics, or a related field (or BS with equivalent industry experience).
    • Experience: 5-8+ years of hands-on experience in semiconductor optoelectronic or LED/laser device engineering.
    • Device fundamentals: Strong grasp of compound-semiconductor device physics, including carrier transport, recombination, and optical emission.
    • Characterization: Proven expertise in electro-optical device characterization and data analysis (L-I-V, spectral, high-speed/modulation measurements).
    • Process fluency: Working knowledge of semiconductor fabrication processes (lithography, etch, deposition, metallization) and their impact on device performance.
    • Tools: Proficiency with data analysis and scripting tools (e.g., Python, MATLAB) and TCAD or equivalent device simulation.

    Preferred Qualifications

    • GaN microLEDs: Prior hands-on experience with GaN-based microLED devices is strongly preferred but not required.
    • High-speed / high-bandwidth LED or VCSEL device experience for optical interconnect or display applications.
    • Experience with large-area or high-density emitter arrays and array-level uniformity/yield.
    • Familiarity with heterogeneous integration or hybrid bonding to CMOS.
    • Track record of patents or peer-reviewed publications in optoelectronic devices.

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