Summary:
This role is responsible for driving the thermal design and optimization of high‑performance computing (HPC) systems using advanced Multiphysics simulations and CAD‑based design support. The role focuses on thermal and CFD modeling to evaluate new concepts, materials, cooling architectures, and CAD models for high‑power‑density applications. By translating simulation insights into robust design recommendations, this position helps enable next‑generation HPC solutions. is responsible for assisting in the development of new products and manufacturing processes. Establishing a sound technical basis for these developments, this role will work closely with internal team members to understand material and manufacturing constraints. With a strong detail-orientation, this position will help document development processes, perform experimental processes, and track results.
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Qualifications: