Compute Subsystem Architect

MediaTek Inc

  • San Jose, CA
  • 30 days ago

    Highlights

    Evaluate architectural implications of 3D-IC and chiplet splits on CMN topology, CHI credit return, and snoop timing; hand off quantified constraints to packaging and physical teams; co-design while maintaining focus on computing architecture. Align design with potential product landing vehicles including custom ASIC solutions and advanced Arm platforms (including future CPU Dielet configurations).

    Numbers & Facts

    LocationSan Jose, CA

    Description

    Job Description MediaTek is seeking a Compute Subsystem Architect to define and build capability in this space ahead of product commitment. The role covers the full Neoverse Compute Subsystem scope: core configuration, CMN topology and parameterization, cache/SLC architecture, and CHI coherency behavior. The role also provides architectural guidance on chiplet and 3D-IC partitioning trade-offs, collaborating with dedicated packaging and interconnect teams on interface definitions.

    Responsibilities

    • Architect compute subsystems (CPU cluster, L2/L3/SLC cache, coherent mesh fabric) for next-generation ASIC and advanced Arm computing platform products.
    • Own CMN topology recommendations: mesh dimension, HN-F/SN-F/RN-F placement, SLC distribution, snoop filter policy, and QoS parameters.
    • Build CPU subsystem performance models to quantify many-core scaling: latency, bandwidth-per-core, and mesh congestion under AI-era workload traffic patterns.
    • Drive technology readiness: track Arm Neoverse CSS/CMN roadmap, identify IP gaps, and lead technical engagement with Arm on architecture and multi-die scope.
    • Evaluate architectural implications of 3D-IC and chiplet splits on CMN topology, CHI credit return, and snoop timing; hand off quantified constraints to packaging and physical teams; co-design while maintaining focus on computing architecture.
    • Align design with potential product landing vehicles including custom ASIC solutions and advanced Arm platforms (including future CPU Dielet configurations).
    • Prepare architecture specifications and technical documents; present trade-offs to engineering leadership and executives.

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