Job Description: Component Planning: End to end component planning for strategic components such as Memory Commodity (DRAM, eMMC, QSPI NAND Flash), Strategic ICs (Timing, Power, CPLD, FPGA), Interconnects (OSFP, QSFP), Custom Mechanicals (Liquid Cooling Cold Plate assemblies) and Manufactuaring Test Equipment (MTP) Material such as SODIMMs, M.2 NVMe SSDs, FPGAs, etc. Cross-Functional Collaboration: Serve as the primary materials liaison between Commodity Sourcing teams and global suppliers to provide visibility on long range planning and supply/demand trends.