Applications Engineer/Program Manager

Qualifications:

• Bachelor’s degree in Mechanical, Electrical, Materials, Chemical, or Automation Engineering (Master’s preferred).
• 8+ years of experience in semiconductor equipment and/or advanced packaging industries.
• Ability to support customer engagements using technical sales support deliverables including application qualification, tool configuration inputs, technical proposals, and RFI/RFQ responses.
• Strong competency leading cross-functional technical alignment between sales, product management, product marketing, and engineering from quotation through tool acceptance.
• Advanced packaging process knowledge including TCB, fluxless TCB, hybrid bonding, flip chip, 2.5D/3D integration, and panel-level packaging.
• Experience managing specifications, acceptance criteria, compliance matrices, and engineering change control.
• Strong executive communication skills, including customer-facing technical reviews, briefings, and structured status updates.
• Willingness to travel frequently to customer sites and work in cleanroom environments; occasional international travel as required.

Responsibilities:

• Serve as the primary technical liaison supporting US West Coast accounts, including customer visits, opportunity reviews, and technical escalation management.
• Lead technical discussions with customer engineering teams and provide pre-sales technical support, including qualification approach, configuration inputs, proposals, and RFI/RFQ responses.
• Translate customer needs into clear product and feature requirements, influence roadmap priorities, and communicate timing and commitments back to customers and internal stakeholders.
• Own purchase specification and acceptance criteria alignment from RFQ through PO, shipment, and final acceptance, including compliance tracking and change management coordination.
• Drive evaluation and demo-to-production execution and provide structured market and competitive intelligence to internal stakeholders.