7096 - Product Development Engineer

ORYX

  • Lehi, Utah
  • 30+ days ago

    Highlights

    If you enjoy solving complex problems at the transistor and process level—and want your work to directly impact production—this role delivers. You’ll take ownership of process integration, drive yield improvements, and help transition advanced nodes into high-volume manufacturing.

    Numbers & Facts

    LocationLehi, Utah

    Description

    Product Development Engineer (28nm CMOS)


    Confidential – Leading Semiconductor Manufacturer


    Why This Role

    This is a rare opportunity to work at the core of 28nm CMOS technology development, where device physics meets real-world production. You’ll take ownership of process integration, drive yield improvements, and help transition advanced nodes into high-volume manufacturing.

    If you enjoy solving complex problems at the transistor and process level—and want your work to directly impact production—this role delivers.


    What You’ll Do


    Process Integration & Device Optimization

    • Develop and refine 28nm CMOS process flows across FEOL/BEOL
    • Optimize transistor performance, variability, and reliability
    • Work closely with device, design, and fab teams to align performance targets


    Yield & Performance Engineering

    • Analyze electrical test data, inline metrics, and defectivity trends
    • Drive yield improvement through root cause analysis and corrective actions
    • Correlate parametric data to process variations and device behavior


    Technology Transfer & Manufacturing Ramp

    • Support transition from development to high-volume manufacturing (HVM)
    • Define process windows, control plans, and production specs
    • Partner with manufacturing teams to ensure stable, repeatable output


    Cross-Functional Collaboration

    • Interface with design, modeling, and reliability teams
    • Contribute to DTCO/STCO efforts for performance and scaling
    • Support failure analysis and long-term reliability improvements


    What You Bring

    • BS/MS/PhD in Electrical Engineering, Materials Science, Physics, or related field
    • ~5–12 years of experience in semiconductor process development or integration
    • Strong background in:
    • CMOS technology (28nm preferred)
    • Process integration (FEOL, HKMG, silicidation, or BEOL)
    • Device physics and electrical characterization
    • Experience with:
    • Yield analysis, DOE, SPC, and failure analysis
    • TCAD or electrical simulation tools (a plus)
    • Ability to work cross-functionally in a fast-paced fab environment


    What Makes This Role Different

    • End-to-end ownership — from process development to production ramp
    • High visibility — direct impact on yield, performance, and business outcomes
    • Advanced node exposure — meaningful work at 28nm and beyond
    • Technical depth — real device-level problem solving, not just incremental optimization


    Ideal Backgrounds

    • Process Integration Engineer (CMOS / Logic)
    • Device Engineer with strong fab interaction
    • Yield / Product Engineer with deep process understanding
    • Engineers from leading IDMs or foundries working on sub-40nm nodes 



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