2nd Shift DieWire Bonder

Job Summary:

Performs basic and routine electronic assembly operations on components or subassemblies. Perform Die Attach, Wire bond, Epoxy Dispense, Flip chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach.

Job Responsibilities:

• Technical Knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach
• This position will be required to set up and run K&S ICONN Wire bonders, XYZ-Tec, and West Bond wire pull equipment. In addition, you will set up and run Besi Datacon 2200, Yamaha Chip Shooter, and EKRA printers.
• Clean PCBs and assemblies throughout the process and after completion. Maintain logs, paperwork, and forms accurately consistent with company policy and practices.
• Must continuously meet/exceed production schedules and deadlines according to quality standards
• Other duties as assigned
• Performs a wide variety of electrical/mechanical product assembly operations on assemblies.
• Prepares assembly work to be accomplished by studying assembly instructions and following blueprint specifications.
• Using assembly drawings and related paperwork (Router, Pick List, bill of materials) to accompany parts through production flow
• Using written instructions to assemble, modify, rework, or reassemble units
• Performs basic and routine electronic assembly operations on components or subassemblies
• Maintains daily records and periodically summarizes activities
• Interface with Engineers and Program Managers
• Process transactions on the Oracle (ERP) system

Required Qualifications:

• Typically requires one year of experience or less
• Ability to work under a microscope for long periods of time
• Strong hand-eye coordination
• Knowledge/ability to read written instructions (assemble, modify, rework, or reassemble units)
• Must continuously meet/exceed production schedules and deadlines according to quality standards
• Ability and willingness to operate and multi-task between 2 to 3 machines
• Must be able to train on third shift (9pm - 6:30am)
• May occasionally be required to work overtime

Preferred Qualifications:

• Technical Knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach, etc.

"This position requires you to access information that is subject to U.S. export regulations. You may only access such information if you are a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government."