Analytical Development, Electricity, Failure Analysis, Laboratory, Materials Analysis, Microscopy, Organizational Skills, Polishing, Presentation/Verbal Skills, Printed Circuit Board (PCB), Process Development, Search Engine Marketing (SEM), Team Player, Technical Writing, Writing Skills
Technician: Engineering Laboratory - II (Failure analysis)
Location: Chandler, AZ (CH5)
Duration: 6 months, extendable
*Please note: This is an on-site role 100% of the time.
The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
MUST-HAVE Qualifications
- Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board are preferred. Knowledge of packaging material property and behavior is beneficial.
- Candidate must also demonstrate good verbal and technical writing skills, work well with a team, deliver under pressure, and well organized.
- Minimum educational qualification is an AS degree in science or engineering and 2-4 years' experience in failure analysis, material analysis, process development or analytical tool development. Must be able to stand and work for at least 6 hours.