Technician: Engineering Laboratory - II

Skill sets required not limited to the following: Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board are preferred. The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.

The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.

Skill sets required not limited to the following:
Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board are preferred. Knowledge of packaging material property and behavior is beneficial.

Candidate must also demonstrate good verbal and technical writing skills, work well with a team, deliver under pressure, and well organized.

Minimum educational qualification is an AS degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development. Must be able to stand and work for at least 6 hours.

EEO

“Mindlance is an Equal Opportunity Employer and does not discriminate in employment on the basis of – Minority/Gender/Disability/Religion/LGBTQI/Age/Veterans.”