Software Engineering Director/Architect, 3Dic P&R & Ai-Driven EDA Automation

Cadence

  • Austin, TX
  • 16 days ago

    Highlights

    Relevant industry experience developing EDA software, design automation flows, AI/LLM-enabled engineering tools, or advanced packaging design solutions. This role will focus on developing robust flow-generation capabilities, debugging assistance, root-cause analysis, and platform integration for 3DIC, interposer, and RDL system flows.

    Numbers & Facts

    LocationAustin, TX

    Description

    At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

    We are looking for a Software Engineer to help build scalable EDA flows and AI-driven automation for advanced 3DIC applications. This role will focus on developing robust flow-generation capabilities, debugging assistance, root-cause analysis, and platform integration for 3DIC, interposer, and RDL system flows.

    Core Responsibilities

    • Build scalable EDA flows using C++, Tcl, Python, and Java.
    • Develop AI/LLM-based automation for 3DIC applications, including flow generation, debugging assistants, and root-cause analysis capabilities.
    • Integrate 3DIC flows into a broader platform system supporting 3DIC, interposer, and RDL system flows.
    • Design and automate workflows that improve usability, productivity, and debug efficiency for complex package and system-level design challenges.
    • Collaborate with cross-functional engineering teams to define requirements, validate flow behavior, and deliver production-quality solutions.

    Required Skills

    • Strong background in EDA data structures and algorithms.
    • Hands-on experience with Tcl, Python, and C++ automation in EDA tools.
    • Experience with DB-driven design flows, such as Innovus or similar implementation platforms.
    • Understanding of 3DIC, interposer, packaging routing, and RDL design flows.
    • Knowledge of constraint-driven design, including timing, signal integrity, DRC, and related implementation constraints.
    • Experience handling large-scale design problems, including high bump-count designs and multi-region routing challenges.

    Preferred Skills

    • Experience with 3DIC, 3.5D, or 2.5D designs.
    • Familiarity with signal integrity, EMIR, and thermal considerations in advanced packaging environments.
    • Experience with LLM or AI systems, including agent frameworks and prompt-to-script automation.
    • Knowledge of multi-tool integration and end-to-end flow automation.
    • Ability to translate complex EDA workflows into scalable, user-friendly automation solutions.

    Education and Experience

    • Bachelor's or Master's degree in Computer Science, Electrical Engineering, Computer Engineering, or a related technical field.
    • Relevant industry experience developing EDA software, design automation flows, AI/LLM-enabled engineering tools, or advanced packaging design solutions.

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