SMT Process Engineer

#Eng-IT-01

The SMT Process Engineer is responsible for developing, optimizing, and sustaining Surface Mount Technology (SMT) processes to support PCBA manufacturing. This role ensures process stability, yield improvement, and product quality through hands-on engineering support, data-driven analysis, and cross-functional collaboration.

The engineer will play a key role in New Product Introduction (NPI), process validation, and continuous improvement initiatives to support advanced electronic manufacturing programs.

Key Responsibilities:

• Develop, configure, and optimize SMT manufacturing processes from NPI through mass production, ensuring readiness for scale and quality targets

• Drive yield improvement and process stability across SMT lines, including stencil printing, placement, reflow, and inspection

• Perform root cause analysis (RCA) on SMT defects (e.g., bridging, tombstoning, voiding, insufficient solder) and implement corrective and preventive actions

• Support SMT line setup, validation, and qualification, including process parameter development and DOE (Design of Experiments)

• Collaborate with Design and NPI teams to perform Design for Manufacturability (DFM) reviews and ensure smooth product launches

• Establish and maintain process documentation, including SOPs, work instructions, PFMEA, and control plans

• Monitor key performance metrics (yield, defect rate, cycle time, OEE) and drive continuous improvement initiatives

• Support line balancing, capacity analysis, and throughput optimization to improve production efficiency

• Provide technical support and training to production teams on SMT processes, equipment, and best practices

• Work closely with Quality and Test Engineering teams to resolve manufacturing issues and improve product reliability

• Evaluate and implement new materials, equipment, and process technologies to enhance manufacturing capability

• Support customer audits, line tours, and technical discussions as needed

Technical Skills:

• Strong experience with SMT equipment, including:

• Pick-and-place systems

• Screen printers

• Reflow ovens

• AOI / SPI inspection systems

• Deep understanding of SMT processes:

• Solder paste printing

• Component placement

• Reflow soldering

• Inspection and defect analysis

• Experience with:

• Root cause analysis (5 Whys, 8D, Fishbone)

• Design of Experiments (DOE)

• Process validation and qualification

• Yield and defect reduction strategies

• Familiarity with IPC standards (IPC-A-610, J-STD-001)

• Proficiency in Microsoft Office (Excel, PowerPoint, Word)

• Experience with CAD/CAM, MES/SFC systems, or process simulation tools is a plus

Preferred Skills:

• Strong analytical and problem-solving skills with hands-on troubleshooting ability

• Ability to work in a fast-paced, high-volume manufacturing environment

• Strong ownership, attention to detail, and sense of urgency

• Excellent communication and cross-functional collaboration skills

• Ability to manage multiple priorities and support production needs

• Experience in high-volume PCBA or server manufacturing environments

• Experience with Lean Manufacturing, Six Sigma, or Kaizen methodologies

• IPC certification (IPC-A-610, J-STSMT D-001)

• Experience supporting NPI builds and ramp-to-production environments

• Experience with failure analysis techniques (cross-section, dye & pry, X-ray, etc.)

Qualifications:

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, or a related field

• 3+ years of experience in SMT process engineering or PCBA manufacturing environment

• Hands-on experience supporting SMT production lines and equipment