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Silicon Product Engineer

Google

San Diego, CA

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JOB DETAILS
JOB TYPE
Full-time, Employee
SKILLS
Analysis Skills, Artificial Intelligence (AI), CAD/CAM (Computer-Aided Design/Computer-Aided Manufacturing), Control Systems, Ecosystems, Electrical Engineering, Electricity, Electro-migration, Equal Employment Opportunity (EEO), Experiment Design, Failure Analysis, Failure Mode and Effects Analysis (FMEA), Failure Reporting Analysis and Corrective Action System (FRACAS), Integrated Circuit Packaging, Maintain Compliance, Manufacturing, Manufacturing/Industrial Processes, Mass Production, Material Science, Package Layout Design, Physics, Polymers, Process Development, Process Improvement, Product Engineering, Productivity Management, Reliability Testing, Root Cause Analysis, SIP (Session Initiation Protocol), Semiconductor Manufacturing, Semiconductors, Statistical Process Control, United States Department of Energy (DOE), Vendor/Supplier Management, Willing to Travel
LOCATION
San Diego, CA
POSTED
30+ days ago

Minimum qualifications:

  • Bachelor’s degree in Electronic Material Science, Polymer Engineering, Electrical engineering, Computer Aided Design, Semiconductor Physics, Manufacturing Statistical Process Control or a related field and 10 years of progressive post-baccalaureate experience in the job offered or in a Silicon Product Engineering-related occupation.
  • Alternatively, will accept a Master’s degree in Electronic Material Science, Polymer Engineering, Electrical engineering, Computer Aided Design, Semiconductor Physics, Manufacturing Statistical Process Control or a related field, and 8 years of experience in the job offered or in a Silicon Product Engineering-related occupation.
  • Position requires 8 years of experience in the following:
    • Advanced Packaging Process Development & HVM Qualification such as for Mobile SOC or SiP (System in Package)
    • IC Packaging Failure Mode and Effects Analysis (FMEA), Design of Experiment techniques (DOE) and Statistical Process Control (SPC)
    • Chip-Package Interaction(CPI) evaluation, Electromigration (EM) Analysis, Package component & board level reliability testing
    • Failure Analysis and Root Cause Corrective Action for IC Packaging
    • Technical engagement and program execution with all packaging ecosystem partners including OSATs, substrate manufacturers, and material/machine suppliers.

About the job

Google's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology.

The US base salary range for this full-time position is $176,150 - $237,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

The Platforms and Devices team encompasses Google's various computing software platforms across environments (desktop, mobile, applications), as well as our first party devices and services that combine the best of Google AI, software, and hardware. Teams across this area research, design, and develop new technologies to make our user's interaction with computing faster and more seamless, building innovative experiences for our users around the world.

Responsibilities

  • Define, develop, and optimize high-volume manufacturing (HVM) processes for advanced semiconductor packaging technologies for consumer devices, ensuring compliance with electrical, thermal, mechanical, environmental, and cost requirements, especially mobile SOC SIP for on-device AI. 
  • Drive process optimization and yield improvement using Design of Experiments (DOE) methodology, and establish rigorous process monitoring and control systems to ensure robust manufacturing. Establish and evaluate the effects of package assembly and bumping processes, specifically assessing Chip Package Interaction (CPI) effects such as Silicon ELK stress and impact on board-level reliability.
  • Lead Electromigration (EM) evaluations for fine-pitch package solutions, defining material and process requirements to meet long-term package development and reliability roadmaps. Perform comprehensive failure analysis and root cause resolution for manufacturing and field issues encountered during both the technology development and mass production phases.
  • Collaborate and manage key suppliers, including OSATs, substrate vendors, and packaging ecosystem partners, to drive technology roadmap execution and establish internal packaging.
  • Domestic and International travel required.
Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google's EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.

About the Company

G

Google

Build for everyone

Since our founding in 1998, Google has grown by leaps and bounds. Starting from two computer science students in a university dorm room, we now have thousands of employees and offices around the world. These Googlers build products that help create opportunities for everyone, whether down the street or across the globe.

It starts with how we work together. We’re building a company where people of different views, backgrounds and experiences can do their best work and show up for one another. A place where every Googler feels like they belong.

So whether you develop new technology or creative campaigns, craft beautiful products or breakthrough partnerships, your work here is a chance to accomplish things that matter. Bring your insight, imagination, and healthy disregard for the impossible. Bring everything that makes you unique. Together, we can build for everyone.

Benefits

We strive to provide Googlers and their loved ones with a world-class benefits experience, focused on supporting their physical, financial, and emotional wellbeing. Our benefits are based on data, and centered around our users: Googlers and their families. They’re thoughtfully designed to enhance your health and wellbeing, and generous enough to make it easy for you to take good care of yourself (now, and in the future). So we can build for everyone, together.

Learn more about Google’s benefits on this site featuring Googlers’ experience.

How we Hire

Google’s hiring process is an important part of our culture. Googlers care deeply about their teams and the people who make them up. In order to  build for everyone, we know that we need a wide range of perspectives and experiences, and a fair hiring process is the first step in getting there.

Learn more about our hiring process.

COMPANY SIZE
10,000 employees or more
INDUSTRY
Computer Software
EMPLOYEE BENEFITS
Paid Sick Days, Performance Bonus, Professional Development, 401K, Stock Options, Employee Events, Retirement / Pension Plans, Tuition Reimbursement, Work From Home, Life Insurance, On Site Cafeteria
FOUNDED
1998
WEBSITE
https://goo.gle/4dbno6V