Senior Thin Films Engineer

Job DetailsJob Description:Organization OverviewManufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.About This RoleJoin Intel's Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.Your MissionLead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next‑generation technology nodes.Key ResponsibilitiesProcess Innovation & ExcellenceChampion safety, quality, yield, throughput, and cost optimization across thin film deposition modulesDrive defectivity reduction and uniformity improvements through systematic process enhancementLead technical problem resolution and deliver solutions that meet aggressive technology node targetsOptimize equipment performance working with internal teams and key suppliersStrategic Technical LeadershipAlign technical vision with customer requirements and business objectivesSynthesize complex technical data to formulate and execute strategic responsesOwn end‑to‑end resolution of manufacturing challenges spanning multiple engineering disciplinesDeliver rapid execution of innovative solutions to meet challenging development timelinesCross‑Functional PartnershipCollaborate closely with Technology Development, High Volume Manufacturing, and Business GroupsBuild strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliersPresent technical findings effectively to diverse audiences from engineering teams to executive leadershipFoster in‑person collaboration to accelerate decision‑making and problem resolutionIndustry LeadershipStay current with semiconductor industry trends and emerging process technologiesDrive strategic initiatives that position Intel at the forefront of manufacturing innovationContribute to technology roadmaps through hands‑on technical expertise and market insightWhat We're Looking ForTechnical ExcellenceResults‑driven professional with exceptional technical problem‑solving abilitiesProven track record of significant accomplishments across multiple technology nodesStrong analytical skills with expertise in yield improvement, performance enhancement, and variation reductionDeep understanding of semiconductor manufacturing strategies, fab operations, and technology transferLeadership CapabilitiesOutstanding communication skills for presenting complex technical information to varied audiencesSelf‑motivated with strong initiative and ability to navigate ambiguous technical challengesDemonstrated ability to manage multiple high‑priority projects under pressure while maintaining quality focusExperience driving clarity in complex technical situations and leading cross‑functional initiativesIndustry ExpertiseComprehensive knowledge of process development, materials science, and device physicsAbility to interpret industry trends and translate market dynamics into actionable technical strategiesExperience with foundry business models and customer engagement requirementsProven capability to work independently while managing diverse technical assignmentsQualificationsMinimum QualificationsMaster's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field5+ years semiconductor industry experience with strong focus on thin film deposition processesProven experience in process development, technical leadership, and manufacturing engineeringExtensive background working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimizationComprehensive fab startup experience across manufacturing, quality, R&D, and supply chain functionsProficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systemsPreferred QualificationsDoctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologiesExpertise in Gate All Around (GAA) logic technologies within semiconductor foundry environmentsProven track record delivering customized solutions across Technology Development and HVM organizationsCross‑functional leadership experience managing diverse stakeholder groupsSemiconductor foundry experienceJob TypeExperienced HireShiftShift 1 (United States of America)Primary LocationUS, Oregon, HillsboroAdditional LocationsUS, Arizona, PhoenixPosting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range$133,800.00 - 255,200.00 USD (US locations)Work Model for this RoleThis role will be eligible for our hybrid work model which allows employees to split their time between working on‑site at their assigned Intel site and off‑site. Job posting details (such as work model, location or time type) are subject to change.#J-18808-Ljbffr