Senior Process Engineer

Senior Process Engineer - Advanced Packaging & ManufacturingLocation: Austin, Texas | On-siteOpportunity SummaryA venture-backed deep technology company is developing advanced photonic and electronic hardware systems for next‑generation computing, communications, aerospace, and national security applications. The products combine sophisticated semiconductor technologies, advanced materials, precision assembly processes, and automated manufacturing techniques to deliver performance and scalability beyond conventional hardware architectures. We are seeking a Senior Process Engineer to lead the development, qualification, and optimization of critical manufacturing and packaging processes that enable these products to move from development into high‑volume production. This individual will play a key role in scaling technologies that may ultimately support data center infrastructure, space‑based systems, communications networks, and other mission‑critical applications.About UsWe are an early‑stage technology company building advanced hardware platforms at the intersection of photonics, electronics, and manufacturing. Our team is focused on solving challenging engineering problems that require precision manufacturing, high‑reliability packaging, and scalable production processes. The technologies being developed have the potential to support a broad range of commercial and government applications, including next‑generation computing infrastructure, aerospace systems, and communications platforms. We operate in a hands‑on, engineering‑driven environment where ownership, execution, and continuous improvement are highly valued. Team members have the opportunity to help shape both the technology and the manufacturing systems required to bring it to scale.Job DutiesLead development and qualification of advanced manufacturing, assembly, and packaging processes from prototype through volume productionOwn process development activities including equipment selection, material evaluation, recipe creation, process characterization, and optimizationDevelop and implement statistical process control methodologies to improve process stability, quality, throughput, and yieldPartner with design, electrical, mechanical, and manufacturing teams to ensure products are designed for manufacturability and production scaleTranslate product and package designs into robust, repeatable manufacturing processesEstablish process windows, operating limits, and manufacturing specifications for critical production operationsDesign and execute process characterization studies to validate performance, reliability, and manufacturabilityPerform root cause investigations, failure analysis, and corrective action implementation to address process and product issuesAnalyze manufacturing and yield data to identify opportunities for continuous improvementSupport equipment qualification, process transfer, supplier engagement, and manufacturing ramp activitiesDevelop process documentation, work instructions, engineering standards, and production proceduresProvide technical mentorship and guidance to engineers, technicians, and manufacturing personnelQualificationsMaster's degree or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related technical discipline3+ years of hands‑on process development experience within semiconductor, microelectronics, advanced manufacturing, or related industriesStrong troubleshooting and problem‑solving skills within manufacturing or development environmentsExperience developing and qualifying production processes from concept through implementationHands‑on experience with semiconductor packaging, wafer processing, advanced assembly, precision manufacturing, or related technologiesExperience applying statistical process control, process capability analysis, and continuous improvement methodologiesAbility to analyze process data and make data‑driven engineering decisionsComfortable working in cleanroom, laboratory, and controlled manufacturing environmentsExperience collaborating across multidisciplinary engineering teamsWillingness to support critical development and production milestones when requiredPreferred Experience6+ years of experience in semiconductor manufacturing, wafer‑level packaging, photonics, microelectronics, or advanced packaging environmentsExperience with wafer processing technologies such as lithography, deposition, etch, polishing, dicing, bonding, or related fabrication processesExperience with advanced assembly techniques including die attach, flip‑chip bonding, wire bonding, precision alignment, or automated assembly systemsFamiliarity with materials characterization and failure analysis tools such as X‑ray inspection, SEM, CSAM, FIB, die shear testing, or related methodsExperience supporting manufacturing scale‑up and production ramp effortsKnowledge of reliability testing, qualification methodologies, and process validation techniquesExperience working with highly automated manufacturing equipment and production environmentsFamiliarity with advanced photonic, optoelectronic, or high‑performance computing hardware systemsWhy Join UsOpportunity to help build manufacturing capabilities for next‑generation computing, communications, and aerospace technologiesSignificant ownership over process development and production strategyDirect impact on product performance, reliability, and scalabilityExposure to challenging multidisciplinary engineering problems at the intersection of hardware and manufacturingEquity participation and long‑term growth potential within a rapidly growing startupCollaborative, execution‑focused environment where strong technical contributions have immediate impactCompensation Details$140,000 - $180,000 per year#J-18808-Ljbffr