Foxconn Technology Group, a global leader in electronics manufacturing, is seeking a Failure Analysis Engineer to lead root cause investigations and drive process optimization. Once a part of the team you will have opportunity to lead real-time yield monitoring and rapid anomaly resolution to maintain target performance; drive dynamic analysis of defective main logic board to build troubleshooting expertise and streamline diagnostics; compile and deliver product analysis and yield reports to inform decision-making; and mentor new engineers and technicians to enhance team technical capability.
1. Track production yield in real time, analyze trends weekly/monthly, and flag critical anomalies for leadership review.
2. Diagnose main logic board defects using advanced tools (oscilloscopes, spectrum analyzers, etc.) to identify root causes and train engineers/technicians on troubleshooting.
3. Respond immediately to yield deviations, lead Root Cause Analysis, and implement Corrective & Preventive Actions to resolve issues.
4. Adhere to company policies and Standard Operating Procedures for quality inspections to ensure consistent, standards-based processes.
5. Deliver weekly yield reports and present monthly trends/anomalies to stakeholders for strategic decision-making.
6. Identify process risks through continuous yield monitoring and recommend improvements to strengthen quality outcomes.
1.Successful completion of 4-years of high school, or equivalent, plus completion of 4 years of college with a bachelor’s degree, plus attainment of a master’s degree. Degree required: Electronic information engineering
2. 3 to 5 years of work experience in failure analysis within Computer, Communication, and Consumer Electronics sectors.