Satellite Payload Hardware Engineer , Amazon Leo

Amazon LEO is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.

Amazon strongly believes in Ownership and you will have the opportunity to own your designs from concept through production. You will own or contribute to the following:

• Own the satellite and ground gateway gigabit modem design from concept through production
• Design and optimize different blocks of electronics sub-systems
• Design high-speed digital circuitry supporting various SERDES protocols in collaboration with various teams
• Design with the latest high speed ADC/DAC and FPGA technology
• Optimize PCB stack-up for performance and cost
• Complete board bring-up and perform test campaigns for different modules and subsystems
• Support the transition of the designs to production

Export Control Requirement:

Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

A day in the life

As a Satellite Payload Hardware Engineer, you will lead the design workstream on some of the most innovative, challenging, and exciting gateway systems high speed modems in industry. You will engage with an experienced team to conceive and design the gateway modems and delight customers with affordable, reliable, high bandwidth connectivity. You will work closely with Amazon LEO"s various sub-teams and engage third party suppliers to drive product definition, design, optimization, implementation, and test. The Hardware Engineer will have a complete understanding of how their design changes impact downstream partners such as operations, supply chain, product management, and reliability.

About the team

The Gateway Modem team is responsible for the architecture, design, implementation, validation, qualification, and new product introduction to manufacturing for all satellite and ground gateway assemblies. These systems will meet performance requirements defined by the RF/modem team as well as environmental and reliability requirements defined by the mechanical team. To this end, the gateway team collaborates closely with all the partner teams including silicon, power, mechanical, thermal, modem, RF/Coms system, and SW teams.