Radar Electronics Packaging Design Mechanical Engineer

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At Leidos, we deliver innovative solutions through the efforts of our diverse and talented people who are dedicated to our customers' success. We empower our teams, contribute to our communities, and operate sustainably. Everything we do is built on a commitment to do the right thing for our customers, our people, and our community. Our Mission, Vision, and Values guide the way we do business.

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Leidos' Ground Based Radar Digitization (GBRD) program is seeking an experienced mechanical engineer to design structural packaging for electronics components within a large radar. This is a large, multi-phase radar program with concurrent development, test, production, and sustainment activities.

As a member on the radar back-end processing team, you will be responsible for the mechanical design aspects associated with component selection, electronics rack sizing, electronics rack shock isolation, electronics layout in the racks, component mounting solutions, cable routing, and cooling solutions.

This role requires a seasoned technical contributor proficient in applying technical principles, theories, and concepts in mechanical engineering and analysis. You will be responsible for developing solutions to technical problems and issues that may be difficult or unclear while collaborating with other members of the mechanical, electrical, and analysis teams.

This is not your average engineering position. You will work on a team of the most talented engineers in the region who push you to be better every day. This is a fast-paced program with unique technical challenges that will be a rewarding milestone in any engineering career.

If you are up for the challenge of joining this team, then apply today to be considered.

Leidos Defense Systems Sector provides a diverse portfolio of systems, solutions, and services covering land, sea, air, space, and cyberspace for customers worldwide. Solutions for Defense include enterprise and mission IT, large-scale intelligence systems, command and control, geospatial and data analytics, cybersecurity, logistics, training, and intelligence analysis and operations support. Our team is solving the world's toughest security challenges for customers with "can't fail" missions. To explore and learn more, click here!

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Primary Responsibilities.

• Support and lead mechanical engineering tasks supporting the design, analysis, manufacture, and emplacement of a new digitized radar system back-end processing solution
• Support and perform technical trade studies
• Apply sound engineering practices to develop concepts using CAD and mature designs that meet system requirements
• Support technical peer, table-top, and internal/external design reviews
• Create and maintain Technical Data Package (TDP) artifacts, including CAD models, drawings, bills of materials (BOMs), and specifications
• Communicate and collaborate effectively with design, analysis, and fabrication teams to resolve challenges

Basic Qualifications.

• Bachelor's degree in Mechanical or Aerospace Engineering from an ABET-accredited university.
• BS + 4 years progressive engineering experience, or MS + 2 years.
• Proficient with structural design via CAD tools such as SolidWorks, Creo, CATIA, or AutoCAD
• Experience with drawing generation in accordance with ASME Y14.100 & Y14.5
• Basic understanding and application of GD&T (ASME Y14.5) and tolerance stack-up analysis.
• Strong attention-to-detail, analytical thinking, and problem-solving skills.
• Excellent communication and collaboration skills.
• Self-starter with a demonstrated ability to work independently and in team environments.
• Proficiency with Microsoft Office applications (Word, Excel, PowerPoint).
• Active DoD security clearance (or eligibility to obtain).

Preferred Qualifications.

• Solidworks experience preferred
• Windchill experience preferred
• Basic understanding or experience with radars or other advanced sensing technologies.
• Experience with electronics packaging, server racks, and cable routing.
• Experience with electronics and server room thermal solutions.
• Experience with technical data and documentation release and management in Windchill.
• Experience supporting rapid development, prototyping, or fast-paced engineering programs.
• Knowledge of MIL-STD-31000 Technical Data Package (TDP) development.
• Active DoD security clearance.

If you're looking for comfort, keep scrolling. At Leidos, we outthink, outbuild, and outpace the status quo - because the mission demands it. We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail. Step 10 is ancient history. We're already at step 30 - and moving faster than anyone else dares.

Original Posting:

July 1, 2026

For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.

Pay Range:

Pay Range $87,100.00 - $157,450.00

The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.