Product Engineer

•    Work on new product introduction and ramp-up of CMOS Image Sensors (CIS) and ASIC products from initial tape-out to mass production.
•    Collaborate with design, test, reliability, and packaging teams to troubleshoot issues and support product development.
•    Perform design rule checks and product validation to ensure robust product design; defining new product process criteria and GDS checks for tape-out.
•    Develop comprehensive product characterization and testing plans with R&D and foundry teams to ensure products performance meets requirements.
•    Ensure product roadmap success by identifying improvement opportunities through physical/electrical failure analysis, process optimization and defect reduction.
•    Access pixel performance through statistical analysis of electrical and functional metrics at both wafer- and chip-level testing.
•    Work with quality engineers to address customer complaints, implement corrective actions, and track improvements after solution implemented to minimize field returns.
•    Collaborate with different foundries to optimize processes, including silicon, color and packaging processes, enhancing overall product performance.
•    Work with testing engineers to develop, verify, and release CP and FT testing programs; perform sensors validation on manual testing board.
•    Improve product yield by process and layout optimization; analyze yield data and drive improvement actions.
•    Define production testing specifications, ensure product yield on target, and reduce process and test fluctuating issue for timely ramp-up.
•    Ensure products meet AEC Q-100 standards and other relevant automotive specifications.
•    Work with foundries to drive continuous yield enhancements, continuous improvement plans (CIP), and best-known-methods (BKM) updates throughout the product lifecycle.
•    Deliver cutting-edge CIS solutions for the automotive industry.

 

Requirements:

Master’s degree in Electrical Engineering, Physics, Material Science or a related field.

One year’s experience in product engineering.

Experience shall include:
•    Support IC-design clients in ramping up the new tape out (NTO) products, sustaining yields for high‐volume production products and improving product quality and functionality.
•    Design rules checks and layout review to ensure robust product design.
•    Experience in raw materials, production processes, quality control, costs, and techniques for maximizing the effective manufacture of products. 
•    Experience in cross-team work for joint project development; coordination with client, Fab and support teams to identify improvement opportunities and implement solutions. 
•    Monitor the CP and FT testing result to gate and resolve issues in mass production.
•    Experience in physical failure analysis techniques, such as TEM, EDX, and OBIRCH.

Annual base salary for this role in California, US is expected to be between $156,853 - $160,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.