$109,200–$223,400 Per Year
Auditing, Chemical Engineering, Continuous Improvement, Identify Issues, Industry Standards, Manufacturing, Mass Production, Mechanical Engineering, Requirements Management, Systems Engineering, Technical Leadership, Vendor/Supplier Management, Willing to Travel
Seeking a skilled engineer or scientist to lead deployment and management of direct-to-chip liquid cooling technology with external manufacturing partners.
Responsibilities include serving as the technical lead, developing specifications, overseeing qualification and mass production, solving performance and manufacturing challenges, reviewing designs, auditing processes, and supporting continuous improvements.
Required skills: 5+ years in thermal systems engineering, experience with liquid cooling, supplier management, and industry standards. A degree in Mechanical, Chemical Engineering, or related fields is necessary.
This role involves collaboration, troubleshooting, and travel to manufacturing sites. Compensation ranges from $109,200 to $223,400 annually, with benefits including health coverage, retirement plans, paid time off, and more.
The position promotes innovation, inclusion, and offers opportunities for growth in a leading technology environment.
O
Oracle
For over three decades, Oracle has been the center of innovation for business software birthplace of the first commercially available relational database, the first suite of internet-based applications, and the next-generation enterprise-computing platform, Oracle Fusion. Today, Oracle provides the world's most complete, open, and integrated business software and hardware systems, with more than 370,000 customers including - 100 of the Fortune 100 - representing a variety of sizes and industries in more than 145 countries around the globe. And Oracle's 110,000 global employees - including 30,000 developers working full-time on Oracle products -are critical to that success.
Oracle Supports Workforce Diversity