Platform - Digital Systems Engineer

We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradynes test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!

We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive.

Our Purpose

TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to innovate and learn something new every day.

We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team - one that makes better decisions, drives innovation and delivers better business results.

Opportunity Overview

The Platform-Digital Systems Engineering position is a highly visible technical leadership role responsible for defining customer-facing test solutions and shaping the architecture of next-generation digital instrumentation for ATE systems. Digital instrumentation aims to address the test needs for AI, high performance compute, advanced memory, mobile and advanced logic devices.

In this role, you will serve as a trusted technical leader at the intersection of customer roadmaps, semiconductor device trends, system architecture, and product execution, translating complex technical requirements into differentiated instrumentation and platform solutions. The ideal candidate combines deep technical expertise, systems-level judgment, and the ability to lead through influence by aligning teams, driving architecture decisions, and guiding technical strategy across hardware, software, firmware, and test methodology.

Key Responsibilities

• Technical Leadership & Roadmap: Lead the definition of long-term technical direction for select digital product lines on Teradyne's flagship UltraFLEXplus tester by analyzing semiconductor, packaging, interface, and test technology trends.
• Architecture Leadership: Drive critical architecture trade-offs and technical recommendations for complex digital instrumentation, balancing performance, scalability, signal integrity, cost, risk, schedule, and long-term extensibility.
• Industry and Technology Leadership: Represent Teradyne in external conferences, standards discussions, and industry forums to gather technical VOC, benchmark emerging technologies, and identify opportunities for differentiated test capability.
• Strategic Technical Influence: Build credibility with customers, device architects, product leaders, and internal engineering teams as a senior technical leader who identifies inflection points where Teradyne can create competitive advantage.

All About You

We seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If you're ready to join us in this mission, take a closer look at the minimum criteria for the position.

• 10+ years of engineering experience, including significant experience as a senior individual contributor, system architect, principal engineer, or technical lead for complex hardware/software systems.
• Proven ability to lead technical direction across engineering teams, customers, product leaders, and executives through clear reasoning, strong technical judgment, and effective communication.
• Strong understanding of digital DFT, semiconductor test strategies, ATE architectures, and production test requirements.
• Deep digital hardware/software systems knowledge, with demonstrated ownership of architecture-level trade-offs across performance, signal integrity, timing, scalability, diagnostics, cost, manufacturability, and product extensibility.
• Demonstrated curiosity and fluency in emerging semiconductor technologies such as high-speed serial interfaces, advanced memory, chiplets, advanced packaging, and AI/HPC device trends.
• Track record of leading ambiguous, cross-disciplinary technical problem solving and mentoring engineers through technical guidance, design reviews, and architecture decision-making.
• Strong teamwork skills.
• Ability to travel domestically and internationally up to 10-20% of the time.

We are an equal-opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status. We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform crucial job functions, and to receive other benefits and privileges of employment.