PCB Board level Designer

Zealogics.com

San Jose, California

JOB DETAILS
SKILLS
Assembly Drawings, Ball Grid Array (BGA), Bill of Materials (BOM), CAD/CAM (Computer-Aided Design/Computer-Aided Manufacturing), Cadence Allegro, Computer Engineering, Database Administration, Design For Excellence (DFX), Design for Assembly (DFA), Detail Oriented, Documentation, Electrical Engineering, Electricity, Electromagnetic Compatibility, Electromagnetic Interference (EMI), Electromagnetic Interference Mitigation, Electronic Engineering, Engineering Drawing, FCC (Federal Communications Commission), High Reliability, High Voltage (HV), IPC Standards, Industry Standards, Library Databases, MCAD - Microsoft Certified Application Developer, Manufacturing, Manufacturing Design, Mechanical Design, Mechanical Engineering, Mentor Graphics, Mixed Signal RF, OrCAD, PCB (Printed Circuit Board) Manufacturing, Package Layout Design, Printed Circuit Board (PCB), Printed Circuit Board (PCB) Layout, Printed Circuit Board Assembly (PCBA), Printed Circuit Board Design, Productivity Management, Reduction of Hazardous Substances (RoHS), Regulatory Compliance, Schematic Capture, Schematics, Signal Integrity, System Integration (SI), Thermal Management
LOCATION
San Jose, California
POSTED
15 days ago

Position Summary

We are seeking a skilled and detail-oriented PCB Board-Level Designer to join our engineering team. In this role, you will be responsible for translating electrical schematics into physical, high-reliability printed circuit board (PCB) layouts. You will collaborate closely with hardware engineers, mechanical designers, and manufacturing partners to deliver optimized layouts that meet strict electrical, thermal, mechanical, and manufacturing constraints.

Key Responsibilities

1. PCB Layout & Component Placement

  • Design complex multi-layer (analog, digital, mixed-signal, and RF) printed circuit boards from schematic capture through to manufacturing release.

  • Execute component placement, stack-up design, and high-speed routing while managing signal integrity (SI) and power integrity (PI) requirements.

  • Implement controlled impedance, differential pairs, length matching, and isolation strategies for sensitive analog/RF signals.

2. Collaboration & Technical Integration

  • Work alongside hardware engineers to interpret schematics, netlists, and specific layout constraints (e.g., high-voltage spacing, thermal dissipation).

  • Interface with mechanical engineers to ensure seamless mechanical integration, utilizing ECAD-MCAD co-design tools to manage board outlines, keep-out zones, and component heights.

  • Participate in formal design reviews to identify potential layout, thermal, or manufacturing risks before production.

3. Library & Database Management

  • Create, verify, and maintain schematic symbols and 2D/3D component footprints according to company standards and IPC-7351 guidelines.

  • Manage the component database, ensuring correct mapping between schematics, footprints, and manufacturer part numbers.

4. DFX & Manufacturing Documentation

  • Apply strict DFX (Design for Excellence) principles, specifically focusing on DFM (Design for Manufacturing) and DFA (Design for Assembly) to maximize production yields.

  • Generate comprehensive fabrication and assembly packages, including Gerber files, ODB++, NC drill files, Bill of Materials (BOM), and detailed assembly drawings.

  • Liaise with PCB fabrication and assembly vendors to resolve technical queries (EQs) during production.

Role Requirements

Education & Experience

  • Education: Bachelor’s degree in Electrical/Electronic Engineering, a related technical discipline, or equivalent practical experience/certification (e.g., IPC CID/CID+).

  • Experience: 3+ years of proven experience in board-level PCB design and layout (scale according to seniority needed).

Technical Skills & Competencies

  • CAD Tools: Proficiency in major PCB design suites such as Altium Designer, Cadence Allegro, OrCAD, or Mentor Graphics Xpedition/PADS (specify your primary tool).

  • Signal & Power Integrity: Strong understanding of grounding strategies, decoupling, EMI/EMC mitigation techniques, and thermal management via layout.

  • Manufacturing Knowledge: Deep familiarity with PCB fabrication processes (FR4, high-frequency laminates, HDI, blind/buried vias) and component packaging (BGA, QFN, 0201/01005 passives).

  • Industry Standards: Working knowledge of IPC standards (IPC-2221, IPC-6012, etc.) and regulatory compliances (RoHS, CE, FCC).

About the Company

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Zealogics.com