Optical Reliability Sr Staff/Principal Engineer

MediaTek Inc

  • San Jose, CA
  • 30+ days ago

    Highlights

    Packaging Reliability: Define and model the Reliability Failure Modes of Silicon / Packaging technologies, specifically targeting challenges in 2.5D / 3D packaging, Multi-Chip-Modules, and high-density optoelectronic interfaces. The ideal candidate combines deep technical expertise in optoelectronics, III-V semiconductor physics, and Advanced Packaging technologies with a data-driven approach to solving complex reliability challenges.

    Numbers & Facts

    LocationSan Jose, CA

    Description

    We are seeking a highly talented Optical Reliability Engineer to own and drive product qualification and reliability activities for next-generation Optical Engines, Micro-LED arrays, and integrated photonic solutions. In this high-impact technical role, you will span the full product Lifecycle-from early design de-risking and NPI through production ramp, supplier management, and field performance. The ideal candidate combines deep technical expertise in optoelectronics, III-V semiconductor physics, and Advanced Packaging technologies with a data-driven approach to solving complex reliability challenges. Key Responsibilities Reliability Strategy & DfR: Partner closely with PIC (Photonic Integrated Circuit), component, and assembly design teams early in development to implement Design for Reliability (DfR) principles. Risk Assessment: Lead FMEA (Failure Mode and Effects Analysis) and DFMEA sessions with cross-functional groups to proactively flag and mitigate potential product failure points. Qualification & Standards: Author and execute comprehensive product qualification plans at the component, assembly, and module levels, ensuring strict compliance with GR-468 (Telcordia) and JEDEC industrial testing standards. Advanced Reliability Modeling: Develop and execute accelerated life test strategies, including Reliability lifetime Modeling, activation energy (Ea) extraction, and use-condition acceleration metrics to extrapolate product reliability boundaries. Packaging Reliability: Define and model the Reliability Failure Modes of Silicon / Packaging technologies, specifically targeting challenges in 2.5D / 3D packaging, Multi-Chip-Modules, and high-density optoelectronic interfaces. Statistical Data Analysis: Utilize statistical tools like JMP to analyze process, qualification, and degradation data to maintain product FIT (Failures in Time) and MTBF estimates. Failure Analysis & Customer Operations: Lead complex root-cause failure analysis (FA) for qualification drop-outs and field returns (RMA), driving robust 8D corrective actions. Ecosystem Management: Oversee qualification execution and scale quality control structures directly with global OSAT partners and contract manufacturers (CM).

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