Micro Electronic Assembler

Mercury Systems Inc

Oxnard, CA

JOB DETAILS
SKILLS
Assembly Drawings, Electronics Assembly, English Language, Government, ISO (International Organization for Standardization), Identify Issues, Mechanical Assembly, Organizational Skills, Problem Solving Skills, Production Schedule, Quality Metrics, Safety Training, Security Clearance, Time Management, United States Citizen, Wire Bonding
LOCATION
Oxnard, CA
POSTED
30+ days ago

As an Associate level Microelectronic Assembler, you will learn and perform a variety of electronic assembly operations. The bulk of these duties will be performing manual wire bonding and or die attach operations on state-of-the-art electronic assemblies and subassemblies for the Department of War.

The devices we create are designed to save American lives on the battlefield and to give our troops a technological advantage over our advisories.

Learn the skills needed to accurately and efficiently build these devices as an associate so that you can advance in your career at Mercury while earning a competitive salary and great benefits.

Job Responsibility

You will be responsible for Die attach and Wire bonding die level components from work Instructions and assembly drawings. You will manipulate items using a variety of tools. Maintaining logs paperwork and forms with accuracy is imperative. Additionally, you will operate and troubleshoot production line equipment and computers to ensure smooth and accurate operation. Excellence will come with continuously meeting and exceeding production schedules and deadlines according to quality standards. You will be expected to self-monitor your workmanship and understand and follow all safety requirements as well as ISO practices and procedures. Perform other duties as assigned.

Required Qualification

Typically requires 0-1 year of experience in mechanical assembly Ability to perform detailed work under a microscope for long periods of time Good hand eye coordination Can Follow detailed written and verbal instructions in English Problem solving skills Enthusiastic cooperative and positive behavior

Preferred Qualification

Microelectronics Assembly skills including the ability to recognize non-conformities Knowledge of FOD and/or ESD Schooling or experience with die attach wire bonding PCB population epoxy or other micro-electronic assembly Experience with Hybond or Westbond or equivalent wire bonders Experience with 0.7 and 0.8 mil gold wire and 2-3 gold mil ribbon bonds Experience with Substrate and Die attach with Silver Epoxy Ability to multi-task and work in a flexible and changing environment with multiple competing deadlines

Security Clearance

This position requires you to access information that is subject to U.S. export regulations. You may only access such information if you are a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government.

About the Company

M

Mercury Systems Inc

Mercury Systems is a leading commercial provider of secure sensor and mission processing subsystems. Optimized for customer and mission success, Mercury’s solutions power a wide variety of critical defense and intelligence programs. Headquartered in Andover, Mass., Mercury is pioneering a next-generation defense electronics business model specifically designed to meet the industry’s current and emerging technology needs.
COMPANY SIZE
500 to 999 employees
INDUSTRY
Other/Not Classified
FOUNDED
1981
WEBSITE
http://www.mrcy.com