IC Packaging Design & Layout Engineer

The IC Packaging Design & Layout Engineer is responsible for the end-to-end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and reliability targets for Clients next generation hardware platforms. The engineer will collaborate with cross functional teams including silicon design, thermal/mechanical analysts, and manufacturing to deliver manufacturable package designs that enable Clients strategic product roadmap.

IC Packaging Design & Layout Engineer

Contract, 9/80 work schedule, may be remote or hybrid

US Citizen ONLY

The IC Packaging Design & Layout Engineer is responsible for the end-to-end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and reliability targets for Clients next generation hardware platforms.
The role requires deep technical expertise in package architecture, high speed layout, signal integrity analysis, and design for manufacturability (DFM). The engineer will collaborate with cross functional teams including silicon design, thermal/mechanical analysts, and manufacturing to deliver manufacturable package designs that enable Clients strategic product roadmap.


Job Description: Duties/Responsibilities Lead concept development for advanced packages (e.g., fan out wafer level, 2.5 D/3 D interposer, system in package). Produce detailed layout for substrates, interposers, and die to die routing using Siemens Xpedition.

Own package-level SI/PI strategy, including high speed digital interfaces, power delivery network (PDN) design, and decoupling strategy.  Perform SPICE, EM, and S parameter simulations to validate SI, PDN, and crosstalk. Partner with mechanical engineers and analysts on die attach, under fill, molding, and thermal interface materials.  Partner with silicon, RF, and board design engineers to co-optimize die floorplans and package interfaces. Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs. Author complete package build documentation, specifications, and test plans. Drive solutions to complex problems with limited direction. contribute to requirements development, propose paths forward, and adapt appropriately to changes in requirements.


Skills/Abilities Proficiency with high density substrate and packaging layout tools.
Experience with Siemens Xpedition is desirable. Solid understanding of high-speed design signal integrity best practices.  Experience with SI/PI analysis using Ansys SIwave and HFSS, Hyperlynx, or other industry standard tools. Excellent verbal and written communication skills. Excellent organizational skills and attention to detail. Excellent time management skills with the proven ability to meet deadlines. Strong analytical and problem-solving skills.  Ability to prioritize tasks. Thorough understanding of engineering theories and procedures.

Education Bachelor's degree in electrical engineering or related field. Advanced degree preferred. Experience 5-10 years’ experience in electrical engineering or related field. Onsite preference is preferred.  However, hybrid or remote can also be considered. 
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