The Tesla AI Hardware team is at the forefront of revolutionizing artificial intelligence through cutting-edge hardware innovation. Comprising brilliant engineers and visionaries, the team designs and develops advanced AI chips tailored to accelerate Tesla's machine learning capabilities. Their work powers the neural networks behind Full Self-Driving (FSD), and Tesla humanoid robot, Optimus, pushing the boundaries of computational efficiency and performance. By creating custom silicon and optimized architectures, the team ensures Tesla remains a leader in AI-driven automotive and energy solutions, shaping a future where intelligent machines enhance human life.
Tesla's AI Hardware team is looking for a highly motivated IC Package Material Engineer who will be part of an IC packaging team responsible for packaging materials for Tesla's AI chip programs. This role involves IC package material development for different system applications including driving material characterizations, package and system application test, data analysis and NPI/MP of new packaging materials. A successful candidate will have a strong background in IC package and system material engineering and be able to thrive in a highly dynamic environment.
Develop IC packaging materials for different system applications including robots, automotive and data center in space with harsh environments
Perform comprehensive material characterization of thermal, mechanical, and electrical properties
Design package test vehicle structures to test material performance at package/system level
Manage material suppliers to drive the roadmap, qualify new materials, negotiate specifications, and ensure supply chain reliability
Collaborate with internal cross-functional teams and external vendors closely for effective project execution
Assist in lab maintenance & operations, optimizing test setups for efficiency, and exploring innovative testing methodologies to support various ongoing projects
Master's Degree in related field or equivalent experience
Excellent engineering problem solving skills with strong physics/fundamentals and excellent project management skills
Must have deep understanding and knowledge of IC package material fundamentals
Strong experience in IC package material design, characterization and manufacturing
Strong experience in IC package architecture and packaging assembly process
Strong experience of working with internal and external x-functional teams
Ability to work on-site at Tesla's Palo Alto office, contributing to a fast-paced, collaborative environment
Benefits
Along with competitive pay, as a full-time Tesla employee, you are eligible for the following benefits at day 1 of hire:
Expected Compensation
$160,000 - $312,000/annual salary + cash and stock awards + benefits
Pay offered may vary depending on multiple individualized factors, including market location, job-related knowledge, skills, and experience. The total compensation package for this position may also include other elements dependent on the position offered. Details of participation in these benefit plans will be provided if an employee receives an offer of employment.