Job Posting TitleEquipment Engineer, Texas Institute for ElectronicsHiring DepartmentTexas Institute for ElectronicsPosition Open ToAll ApplicantsWeekly Scheduled Hours40FLSA StatusTo Be Determined at OfferEarliest Start DateOngoingPosition DurationExpected to ContinueLocationPICKLE RESEARCH CAMPUSJob DetailsMust be eligible to work in the United States on a full‑time basis for any employer without sponsorship.About UsThe Texas Institute for Electronics (TIE) is a University of Texas at Austin‑supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state‑of‑the‑art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing.With over $1 billion in funding from the US DoD and the state of Texas, we're at the forefront of creating cutting‑edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more.BenefitsCompetitive health benefits (employee premiums covered at 100%, family premiums at 50%)Voluntary Vision, Dental, Life, and Disability insurance optionsGenerous paid vacation, sick time, and holidaysTeachers Retirement System of Texas, a defined benefit retirement plan, with employer matching fundsAdditional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)Flexible spending account options for medical and childcare expensesRobust free training access through LinkedIn Learning plus professional conference opportunitiesTuition assistanceExpansive employee discount program including athletic ticketsFree access to UT Austin's libraries and museums with staff ID cardFree rides on all UT Shuttle and Austin CapMetro buses with staff ID cardPurposeThis position's primary function is to ensure the overall equipment effectiveness of semiconductor and packaging process equipment in our fabs. We are filling positions for equipment engineers in these functional equipment areas: lithography, high‑vacuum plasma, wet processing, mechanical processing, and metrology and inspection. Equipment engineers will be responsible for equipment installation, the creation of equipment maintenance procedures and schedules, parts‑and‑kit selection‑or‑creation. Equipment engineers will work closely with process tool owners and integration engineers to ensure we are driving fast cycles of learning in semiconductor advanced packaging.Each equipment engineer will be responsible for one of these functional groups of equipment. TIE is filling one position per functional area.Lithography: Coat tracks, Steppers, Litho‑specific metrologyHigh‑Vacuum Plasma: CVD, Etch, Plasma Dicing, PVDWet Processing: Batch cleaning, single wafer cleaning, platingMechanical Processes: CMP, Grinding, Dicing, BondingMetrology and Inspection: SEM, Defect Inspection, Film Thickness, MicroscopesResponsibilitiesDrive and approve installation packagesManage MEP schedule and installationEnsure safety complianceManaging acquisition and installation of pedestals, VMBs, LDS, process piping, exhaust, drains and related itemsOversee subcontractorsCreate and maintain equipment specificationsMaintain SPC charts, including reacting to trendsDevelop technician training plansDevelop maintenance checklists and schedulesDevelop process kitsMaintain equipment dashboards and OEE analysis reportsParticipate in or drive tool selections, equipment procurement, upgrade planning, parts managementPerform other related functions as assignedRequired QualificationsBachelor's degree in an engineering discipline, such as electrical, chemical, or mechanical, or similar related technical fieldThree years of engineering experience in a semiconductor fab or semiconductor advanced packaging facilityEquipment installation project management experienceStatistical process control experienceAbility to work independently and excellent interpersonal communication and written skillsDependable, stable under pressure, and able to adapt to changeRelevant education and experience may be substituted as appropriate.Preferred QualificationsFive or more years of semiconductor equipment engineeringMaster's degree or higherSalary RangeTIE pays industry competitive salaries.Working ConditionsJob duties may be performed in a clean room environment, in awkward positions and/or in high places. Mechanical aptitude, manual dexterity and ability to lift/carry objects up to 35 pounds may be required.May require bending, stooping, crawling, climbing and use of PPE.May work around chemical fumes, biohazards, chemicals, electrical and mechanical hazards.May be required to work in confined spaces, tunnels, on elevated platforms.Required MaterialsResume/CVThree work references with their contact information; at least one reference should be from a supervisorLetter of interestEqual Opportunity EmployerThe University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.#J-18808-Ljbffr