Duration: 12 Months ContractSchedule: Day ShiftJob Description:- The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
Experience:- 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development
Skillsets:- Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board are preferred.
- Knowledge of packaging material property and behavior is beneficial.
- Candidate must also demonstrate good verbal and technical writing skills, work well with a team, deliver under pressure, and well organized.
Education:- Minimum educational qualification is an AS degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development. Must be able to stand and work for at least 6 hours.
Additional Qualifications:- Licenses: NA
- Certifications: NA
- Shift Hours: Standard Day Shift
About US Tech Solutions: US Tech Solutions is a global staff augmentation firm providing a wide range of talent on-demand and total workforce solutions. To know more about US Tech Solutions, please visit
www.ustechsolutions.com .
US Tech Solutions is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, colour, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.
AI Statement: By applying, you acknowledge that AI-assisted tools may be used during hiring.