Engineer II

Operates laboratory equipment in line with the FSI research projects and service agreements and packaging development initiatives as needed. Laboratory equipment includes etching, dicing, packaging, thermal testing, X-ray tomography, dual beam FIB/SEMs, scanning acoustic microscope, digital microscope, probe station, sample preparation, optical microscope, etc. Additional tasks involve optimizing workflows for reliability studies and ensuring compliance with industry standards in packaging technologies.

Monitors, maintains, calibrates, and troubleshoots laboratory and mechanical room equipment. Communicates and oversees infrastructure changes and updates in lab and mechanical room facilities (including vacuum pumps, air compressors, water chiller, etc.) as needed and keeps the laboratory and mechanical room secure and well organized. Orders necessary parts and consumables for assigned labs, working closely with vendors on competitive pricing.

Leads data collection and management for projects, follows guidelines, and with restrictions of such projects.

Trains new users, including undergraduate and graduate students, postdoctoral associates, and other professional engineers on proper use of equipment and lab procedures. Coordinates and instructs graduate engineers in laboratory equipment operations and functions, as well as manages lab access for each. Maintains logs of instrument usage, as well as users, and manages access of laboratory equipment and review of security camera footage.

Researches and studies new tools and methods to operate the equipment in order to stay up-to-date with evolving test and measurement capabilities.  Also provides consultation and assistance to the faculty and others in use of the laboratory.

Performs tasks for FSI research laboratory and other interanl and external collaborators. Assists faculty and other FSI researchers or engineers in collecting data and writing sponsored research reports and technical papers for publication and/or presentation.

B.S. in electrical engineering, mechanical engineering, materials science or other relevant disciplines

Experience with IC packaging, advanced packaging.

Microelectronics and semiconductor fabrication knowledge

Hands-on processing, metrology, reliability, and failure analysis experience.

Operating semiconductor fabrication and reliability test tools (i.e. thermal, stress, humidity, etc.).

Direct experience in operating lab equipment and general lab management

Experience with 3D image analysis software (VisualSI, ImageJ, Avizo, ORS, etc.).