Engineer, Design

Amkor Technology, Inc. (Nasdaq: AMKR) is the world's largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world's leading semiconductor and electronics companies to bring advanced technologies to market. The company's comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.

Position Summary:

Amkor Technology is currently hiring an IC package Design Engineer for its Tempe, AZ location. This position requires the ability to create high-quality IC package designs and detailed engineering drawings and help sustain multiple design-related activities within the Design Center.

Essential Duties and Responsibilities:

• Design Laminate (BGA) and Wafer Level packages, determining design rules, design optimization/verification, and selecting package type for thermal, mechanical, and electrical aspects
• Create detailed engineering drawings with little supervision
• Utilize skills and experience to solve design problems and customer issues
• Seek out opportunities to improve and advance design technology
• Exercise responsibility when making design-related decisions

Create and sustain effective, productive, and quality partnerships between the design team and customers

• Interact with Amkor Product Group & Sales teams to ensure customer requirements are met; interface with internal and external customers as required
• Create documentation and perform record-keeping
• Lead by example while learning
• Other duties as assigned

Required Qualifications:

• This position requires a bachelor''s degree in Electrical Engineering, Mechanical Engineering, or other relevant engineering disciplines
• Demonstrated experience using CAD or equivalent software to create engineering drawings
• Good verbal and written communication skills
• Demonstrates the ability to efficiently complete tasks with minimal supervision
• Must be self-motivated and team-oriented with the ability to meet aggressive schedules and able to work well in a team environment

Preferred Qualifications:

• Semiconductor packaging experience is a plus
• Experience using package design and simulation tools (Cadence APD, Cadence Sigrity, Siemens Expedition, Ansys HFSS, and CAM350)
• PCB design experience is a plus
• Working knowledge of GD&T practices is helpful
• SI/PI experience is a plus

Location:

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office.

Please note: This position may require access to export-controlled information. Candidate must be a U.S. Person (U.S. citizen, lawful permanent resident, or protected individual) or be eligible to qualify for a U.S. Government export authorization.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.