PRIMARY DUTIES
• Digital, analog, mixed-signal and RF design
• Schematic capture and/or layout using EDA software (Mentor Graphics PADS
• Ability to decipher, evaluate and characterize new technologies (ICs, SOCs, modules) for use in our designs
• Able to specify the operational requirements of a PCB assembly from system specifications
• Design hardware to suit given requirements and document the design
• Perform digital, analog, mixed-signal and RF analysis, & test
• Electromagnetic or SPICE circuit stimulation a plus
• BOM generation and specify components for PCBs
• Oversee PCB fabrication and PCB assembly done at outside suppliers
• Test, debug and evaluation of PCB assemblies
• Ability to work on multiple projects efficiently
• Troubleshooting and integration of circuits and systems
• Working with research and software teams to evolve solutions from concept to reality
SKILLS AND QUALIFICATIONS
• BSEE 10+ years experience (MSEE 5+ years experience)
• Strong background in digital and analog design with aptitude in RF and microwave concepts
• Design for manufacturing experience preferred
• Experience with printed circuit boards and digital boards
• EDA, (Mentor Graphics PADS or equivalent)
• Ability to seamlessly utilize lab instrumentation, such as oscilloscopes, network analyzers & spectrum analyzers and aptitude as a quick-learn on other equipment
• Familiar with embedded systems
• Understanding of nuances of hardware/software interface and ability to design products with interdisciplinary teams that have efficient hardware/software interface
• Experience with high speed circuitry
• EMI/EMC design & test preferred
Desired:
• Experience in RF circuit design for receiver systems
• Experience in high-speed digital/RF PCB design from schematic capture to board layout.
• Design experience with products including embedded hardware and FPGA architecture
• Electromagnetic simulation tool experience a plus.
• Programming or C/C++ experience