DICING SPECIALIST, SILICON ASSEMBLY (STARLINK)
One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers, and leadership.
The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step.
RESPONSIBILITIES:
• Operate and program dicing equipment, including diamond saws, laser dicers & groovers, plasma dicers, and stealth dicing systems • Perform full-cut, partial-cut, or scribe-and-break processes on silicon wafers and large-format panels • Develop and refine dicing recipes by adjusting parameters such as blade speed, coolant flow, laser power, and feed rate to achieve clean edges, low die strength loss, and high dice-per-wafer efficiency • Perform in-process and post-dicing inspections using tools like optical microscopes, die shear testers, and particle counters to evaluate edge quality, chipping rates, and contamination levels • Troubleshoot equipment issues, such as blade wear or alignment errors, and conduct preventive maintenance to ensure tool uptime and consistent performance • Collaborate with frontend process teams and packaging engineers to integrate dicing into the overall assembly flow, supporting technology transfers for new wafer sizes (e.g., 300mm) or panel formats (e.g., 600mm) • Document dicing data, generate reports on metrics like throughput, yield loss, and die crack rates, and participate in DOE for process improvements and cost reduction • Maintain cleanroom protocols, including wafer handling best practices, ESD controls, and safety measures for high-speed machinery and laser operations • Support inventory management for consumables like blades and tapes, and assist in qualifying new dicing technologies for high-density interconnects
BASIC QUALIFICATIONS:
High school diploma or equivalency certificate 3+ years of professional experience in a hands-on manufacturing environment; OR Bachelors degree in an engineering, math or science discipline
PREferred SKILLS AND EXPERIENCE:
Bachelors degree in an engineering, math or science discipline 6+ years of experience in silicon wafer or panel dicing within a semiconductor or microelectronics manufacturing environment Proficiency with dicing tools and techniques, including mechanical sawing, UV laser dicing, and handling of thinned wafers or glass panels Strong analytical skills with familiarity in data tools (e.g., Excel, SPC software) for yield tracking and process variability analysis Ability to work in a shift-based cleanroom, including nights and weekends, with physical capability for precise manual tasks and equipment setup Commitment to safety standards and quality control in a high-precision, high-volume setting Experience with advanced dicing for heterogeneous integration, such as chiplets or 3D stacking, or handling ultra-thin wafers Certification in semiconductor backend processing (e.g., SEMI, IPC) or familiarity with automation in dicing lines Background in lean manufacturing (LSSGB), root cause analysis (e.g., 8D), or integration with MES systems for real-time monitoring
ADDITIONAL REQUIREMENTS:
Must be able to work all shifts & be willing to work overtime and/or weekends as needed Standing for long periods of time, climbing up and down ladders, bending, grasping, sitting, pulling, pushing, stooping, and stretching may be required to perform the functions of this position Must be able to lift up to 25lbs. unassisted