AMD in Austin is seeking a forward‑looking engineer to lead the development and deployment of AI‑driven workflows for next‑generation packaging design automation. You will accelerate heterogeneous integration technologies, including substrates, organic interposers, and bridge interconnects, in a fast‑paced environment.You will drive AI/ML workflows, collaborate with EDA vendors to define roadmaps, and mentor engineers while presenting ROI and tool advancements to executives.#J-18808-Ljbffr