Field Service Engineer (Process-Focused) – Advanced Packaging (FOWLP) and Process Engineering
Silicon Desert Staffing LLC
Phoenix, AZ
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JOB DETAILS
JOB TYPE
Full-time, Employee
SKILLS
Acceptance Testing, Analysis Skills, Artificial Intelligence (AI), Business Development, Calibration, Chemical Engineering, Cleanroom, Communication Skills, Cross-Functional, Customer Relations, Customer Support/Service, Documentation, Electrical Engineering, Electricity, Engineering, Equipment Maintenance/Repair, Equipment Specification, Failure Analysis, Identify Issues, Lift/Move 50 Pounds, Manufacturing Equipment, Material Moving, Material Science, Mechanical Engineering, On Site Support, Preventative Maintenance, Problem Solving Skills, Process Development, Process Engineering, Process Improvement, Process Manufacturing, Product Demonstration, Product/Service Launch, Productivity Management, Programmable Logic Controller (PLC), Reporting Skills, Research & Development (R&D), Sales, Schematics, Semiconductors, Technical Support, United States Department of Energy (DOE), Weighting
LOCATION
Phoenix, AZ
POSTED
3 days ago
*Field Service Engineer is responsible for equipment installation,
maintenance, modification of equipment in the field, sales of
maintenance parts and troubleshooting. The secondary responsibility is developing, optimizing, yield improvement, process integration, and customer technical support, and sustaining fan-out wafer level packaging (FOWLP) processes. Role Weighting Process Engineering: Approximately 10-20% Field Service Engineering: Approximately 80-90%
Key Responsibilities
*Field Service Engineering (Primary Responsibility)
*Equipment Installation & Maintenance
*Support installation, setup, and qualification of backend equipment
*Perform and support FAT/SAT and customer acceptance testing 42840 Christy Street, Fremont, CA 94538, USA
*Execute preventive and corrective maintenance as needed
*Discussion about specification of modification of equipment in the field.
*Sales activities of maintenance parts
*Equipment Troubleshooting & Escalation Support
*Troubleshoot mechanical, electrical, pneumatic, vacuum, and software issues of equipment, wafer handling robots, aligners, EFEM and new products that TAZMO Japan develops and market in the future.
*Diagnose process-induced tool issues and coordinate resolution
*Support tool calibration, recipe setup, and tool matching
*Documentation & Feedback
*Prepare service reports, RCA documentation, and customer communications
*Provide structured feedback to engineering teams for tool and process improvement
*Propose maintenance contract
*Prepare specification sheet of equipment
*Process Engineering
*FOWLP Process Development & Optimization
*Setup demo environment and an office in Arizona
*Develop new businesses by conducting demonstrations
*Develop, qualify, and optimize process, including Temporary carrier bonding and debonding
*Optimization of process
*Lead DOE, SPC analysis, and yield improvement initiatives
*Customer & Cross-Functional Technical Support 42840 Christy Street, Fremont, CA 94538, USA
*Serve as the primary technical interface for process-related topics
*Support customer process integration, NPI, and ramp to HVM
*Collaborate with product, equipment, quality, and R&D teams
*Support customer technical reviews, audits, and escalations
*Other general duties are based on projects or particular assignments as needed
Required Qualifications
*Bachelor's or master's degree in
-Materials Science
-Electrical Engineering
-Chemical Engineering
-Mechanical Engineering
Experience
5–10 years of experience in
-Semiconductor backend process engineering, and
-Advanced packaging or wafer-level packaging environments
-Hands-on experience with FOWLP processes and manufacturing equipment
-Technical Skills
-Backend process of semiconductor
-SPC, DOE, Cp/Cpk analysis
-Failure analysis and yield modeling
-Cleanroom and HVM environments
-Ability to read and interpret:
-Electrical schematics
-Mechanical drawings
-Pneumatic and vacuum diagrams
Preferred Qualifications
*Experience supporting backend factories
*Knowledge of PLC
*Familiarity with power devices, AI/HPC packaging requirements
*Prior field service or customer-facing engineering experience
*Knowledge of slit die coating
*Soft Skills
*Strong analytical and structured problem-solving skills
*Excellent customer-facing communication abilities
*Ability to work independently at customer sites
*High level of ownership, accountability, and technical credibility
*Ability to communicate in traditional Chinese 42840 Christy Street, Fremont, CA 94538, USA
Misc.
*This job description is not an employment contract.
*This job description may be revised each year or as business needs dictate. Also, the description may be subject to change at management's discretion at any time.
*The job description does not constitute any assurance or guarantee of employment. The employee’s employment by the Company is understood as “Employment-at-Will.
*Ability to routinely lift, pull, or push objects, up to 50 pounds with or without accommodation.
About the Company
S
Silicon Desert Staffing LLC
INDUSTRY
Manufacturing - Other