Physical Failure Analysis Engineer

• onsemi is seeking an early to mid-career self-driven, hands-on, engineer / scientist to join their Product Analysis Lab, located in Phoenix, AZ. As a Physical Failure Analysis (PFA) Engineer, you will have the opportunity to utilize leading edge tools and techniques to prepare and image physical defects causing electrical failure in a wide variety of onsemi products with a focus on silicon-carbide (SiC) power modules. The Product Analysis Lab in Phoenix is focused on providing best-in-class analytical support for the Company, not only in completing high quality Failure Analysis (FA) work but also in driving technological advancements and efficiency gains in the FA process through method development and innovation. This position requires an innovative approach to problem solving through sample preparation and use of various analytical tools. Method development is a key component of this position.

Performance Objectives:

The successful candidate will have the opportunity to:

• Perform PFA of onsemi SiC power modules and other semiconductor components - internal qualifications/evaluations failures, design debug and key external customer returns. The portfolio includes a wide variety of ICs including SiC, complex image sensors, smart discrete power modules, analog, and mixed-signal devices.
• Development of sample preparation methods, including local and global removal of metal, ceramic, and polymer layers on image sensors and power modules is a core component of this position. This work will be done using existing lab tools (precision mills, polishers, lasers, and chemical methods) as well as investigation of new tools.
• The PFA engineer will operate multiple SEM and FIB tools often using CAD software to drive to areas of interest.
• SEM work may include various imaging techniques including SE / BSE and EDS x-ray microanalysis of semiconductor and metallurgical structures. Imaging of electrically active defects using passive voltage contrast, and EBIC / EBAC using nanoprobing may also be required. AFM scanning capacitance microscopy is also available.
• FIB work may include progressive cross-sections, TEM liftout sample prep, and FIB circuit edits (probe pads, jumpers, isolating circuits).

Requirements:

• BA/BS engineering/technical + minimum of 3 yrs of related experience

Additional Skills of Interest:

• Prior work with wide bandgap semiconductor devices and ceramics knowledge is highly desired.
• A strong interdisciplinary interest in physics, chemistry, and multiple engineering disciplines will be used.
• Experience with fractography, dielectric material characterization and basic electrical testing procedures would be of great benefit.
• Ability to successfully modify equipment, design simple jigs and fixtures, work with vacuum systems, and perform mechanical / electrical troubleshooting are strong attributes.
• Familiarity with metal working tools such as mills and lathes would be useful.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

• Job Identification: 2502035
• Job Category: Engineering
• Posting Date: 09/04/2024, 01:19 AM
• Degree Level: Bachelors
• Job Schedule: Full time
• Job Shift: Day
• Locations: 5005 E Mcdowell Road, Phoenix, AZ, 85008-4229, US