Are you interested in being part of Intel's strategy to advance Moore's law for the next 50 years? Are you passionate about your personal growth and Intel's culture initiatives? Then WATD is the place for you. As the needs for the worlds compute capabilities have evolved and grown, advanced packaging has become a critical part of the semiconductor industry roadmap. Wafer Assembly Technology Development (WATD), a part of Assembly and Test Technology Development (ATTD), is at the center of Intel's advanced packaging technology development. We are enabling next gen disaggregated xPU architectures bringing 2.5D and 3D integrated circuit packaging techniques such as Foveros, EMIB, Omnidirectional Interconnect (ODI) and Hybrid Bonding (HBI) to life. WATD develops and integrates novel equipment, processes, and manufacturing operations to empower innovative products based on chiplet designs. Responsibilities may include, but not be limited to: Role model safety, producing an injury free environment; Lead equipment development projects, including the selection of first-of-a-kind wafer level packaging technologies, Developing new toolsets into HVM solutions compatible with Industry 4.0 standards, Maintain equipment manufacturability within a technology development environment; Driving robust integrated flow solutions; Applying principles for design of experiments and data analysis; Defining strategies to drive solutions to a wide range of theoretical and practical problems; Conducts tests and research on basic materials and properties; Provides consultation concerning packaging problems and improvements in the packaging process; Successful candidates must possess the following qualities: Be inclusive, breaking down silos and developing solutions that push the boundaries of technical innovation; driving the One Intel culture; Be willing to learn and build on what Intel has already accomplished; Collaborate with our partners to drive projects to completion; A proactive nature; solving problems before they become a real problem; producing a quality first environment; A passion for growth and development; not only yourself but others around you and the organization; Willingness to be open and communicate issues, good or bad; Desire to bring your full self to Intel; integrating your culture into ours; Be able to apply program management principles to thrive in a complex environment with many unknown variables; What we offer: We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation). We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work.
We are looking for passionate engineers who are looking to help grow our team into the premiere advanced packaging site in the world.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and internship experience.
Possess a Master's degree in Engineering, Material Science, Physics, Chemistry or STEM related field
**Inside this Business Group**
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here: [ Link removed ] - Click here to apply to Advanced Packaging / Wafer Level Assembly Technology Development Engineer
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. **In certain circumstances the work model may change to accommodate business needs.**