ASIC (Application Specific Integrated Circuit), Analysis Skills, Bit Error Rate (BER), Communication Skills, Cross-Functional, Ethernet, HFSS (High Frequency Structure Simulator), HSPICE, IP (Internet Protocol), Marketing, PCI Express (PCI-E), Post-Sales, Presentation/Verbal Skills, Printed Circuit Board Design, Reliability Analysis, SERDES, Semiconductors, Signal Integrity, Simulation, Substrate Design, System Integration (SI), Team Player, Technical/Engineering Design
We are seeking a Senior Package Design Engineer to join our custom SOC/ASIC development client. You'll work closely with cross-functional teams in the U.S. and overseas on high-performance package substrate design with a focus on signal/power integrity and routing.
Key Responsibilities:
- Perform package substrate design and analysis (SI/PI/routing)
- Collaborate with layout engineers, marketing, and global design teams
- Use tools like HFSS, ADS for package modeling/simulation
- Contribute during pre/post-sales processes
Why is This a Great Opportunity
This is an outstanding technology, great opportunity to learn. Growing company with a lot of IP. Everyone contributes.
Qualifications:
- BS in EE or related field; MS preferred
- 8–10 years of experience in semiconductor package design
- Strong SI/PI analysis, modeling, and simulation skills
- Excellent communication, teamwork, and presentation abilities
Preferred Skills:
- Expertise in high-speed package/PCB design (SerDes, PCIe, LPDDR, Ethernet)
- Time/frequency domain analysis, impedance, jitter, eye-diagram, BER analysis
- Experience with Hspice, Redhawk, electro-thermal simulation, PDN modeling
- Familiarity with reliability analysis and packaging/assembly rules